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Leveraging Multi-Protocol PHY For PCIe To Cope With SoC Design Complexity
By Cadence - 26 Jan, 2022 - Comments: 0

Now in the post-Moore’s Law era, the fast-evolving semiconductor market is continually geared toward higher performance and feature-rich integrated chip (IC) solutions. More functional design blocks integrated with growing interconnections—to not only increase the overall throughput but also expand the I/O connectivity—resulted in a more powerful system on chip (SoC). This increasing comp... » read more

Radar Systems
By Cadence - 05 Jan, 2022 - Comments: 0

Combined with advances in phased-array antennas and integration technologies, radars are moving beyond military/aerospace markets to address a host of commercial applications. This white paper showcases how the Cadence AWR Design Environment platform provides designers with a host of modeling and simulation technologies needed to meet the challenges of all types of radar system design. Click h... » read more

Holistic FMEDA-Driven Safety Design And Verification For Analog, Digital, And Mixed-Signal Design
By Cadence - 21 Dec, 2021 - Comments: 0

With state-of-the-art electronics propelling the automotive industry into the future, automotive OEMs require safety-certified semiconductors. The integration of these advanced technologies into cars drives a need for component suppliers to assess and audit the risk of the technologies they want to deploy. At the same time, safety requirements are constantly evolving and becoming more stringent... » read more

The Physics Of Ports And Associated Ground For EM Simulators Serving RF Designs
By Cadence - 09 Dec, 2021 - Comments: 0

The use of ports in electromagnetic (EM) simulators has evolved and matured over the years to make real-world design simulations practical. Having a foundational understanding of ports provides an intuitive skill in their proper selection and use in conjunction with circuit simulation. In this white paper, we examine ports common to EM simulators, which are the most common simulators for microw... » read more

Interop Shift Left: Using Pre-Silicon Simulation for Emerging Standards
By Cadence - 22 Nov, 2021 - Comments: 0

The Compute Express Link (CXL) 2.0 specification, released in 2020, accompanies the latest PCI Express (PCIe) 5.0 specification to provide a path to high-bandwidth, cache-coherent, low-latency transport for many high-bandwidth applications such as artificial intelligence, machine learning, and hyperscale applications, with specific use cases in newer memory architectures such as disaggregated a... » read more

Energy-Efficient SoCs For The Zettabyte Era Using Power-Saving IP And System Design Techniques
By Cadence - 10 Nov, 2021 - Comments: 0

As the modern world becomes increasingly connected, businesses and consumers alike are relying more and more on digital data. Behind the scenes, data centers that manage all of this digital data are a somewhat silent, yet impactful, part of this connectivity revolution. These data centers are lined with servers that process digital data for everything from social media status updates to analyti... » read more

RF/Microwave Technology Driving The Connected Car
By Cadence - 03 Nov, 2021 - Comments: 0

In-car networks and advanced driver-assistance systems (ADAS), made possible through wireless sensors, driver-assist radar, vehicle communications, and related electronics, present many design challenges to engineers. Simulation software enables design teams to effectively manage the complex design and integration challenges associated with developing these high-speed and RF-enabled networks. T... » read more

3D-IC Design Challenges And Requirements
By Cadence - 27 Oct, 2021 - Comments: 0

As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design and packaging teams are taking a close look at vertical stacking multiple chips and chiplets. This technology, called 3D-IC, promises many advantages over traditional single-die planar designs. Some are using the term “More-than-Moore” to describe the potential of this new technology. Integratio... » read more

Fast And Simple Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver
By Cadence - 06 Oct, 2021 - Comments: 0

3D PCB Electromagnetic (EM) Bending Analysis Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness. Electromagnetic (EM) analysis of Rigid-Flex PCBs has always been a challenging task for many commercially available 3D numerical solver technologies (FEM and F... » read more

Thermal And Stress Analysis Of 3D-ICs With Celsius Thermal Solver
By Cadence - 22 Sep, 2021 - Comments: 0

As electronics get smaller and faster, the environment for thermal issues is becoming more and more challenging. These problems are widespread and can appear in the chip, the board, the package, and the entire system. This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence Celsius  Thermal Solver helps designers analyz... » read more

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