Author's Latest Posts

3D-IC Design Challenges And Requirements

By Cadence - 27 Oct, 2021 - Comments: 0

As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design and packaging teams are taking a close look at vertical stacking multiple chips and chiplets. This technology, called 3D-IC, promises many advantages over traditional single-die planar designs. Some are using the term “More-than-Moore” to describe the potential of this new technology. Integratio... » read more

Fast And Simple Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver

By Cadence - 06 Oct, 2021 - Comments: 0

3D PCB Electromagnetic (EM) Bending Analysis Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness. Electromagnetic (EM) analysis of Rigid-Flex PCBs has always been a challenging task for many commercially available 3D numerical solver technologies (FEM and F... » read more

Thermal And Stress Analysis Of 3D-ICs With Celsius Thermal Solver

By Cadence - 22 Sep, 2021 - Comments: 0

As electronics get smaller and faster, the environment for thermal issues is becoming more and more challenging. These problems are widespread and can appear in the chip, the board, the package, and the entire system. This white paper helps designers understand the cross-fabric thermal and stress challenges introduced by 3D-ICs and how the Cadence Celsius Thermal Solver helps designers analyz... » read more

Designing High-Performance Electronics For Today’s Hyperconnected Systems

By Cadence - 08 Sep, 2021 - Comments: 0

With the rapid evolution of hyperconnected devices that are managing constant and near-instantaneous data from anywhere and at any time, designing at each new technology node must overcome design and integration complexity. To do so requires automated solutions to process the scale of modern designs. Cadence system analysis solutions operate on unimaginably huge amounts of data, scaling algorit... » read more

Internet of Things (IoT) E-Book

By Cadence - 01 Sep, 2021 - Comments: 0

The wide range of internet of things (IoT) applications in development today are made possible by smart devices operating across different network configurations, frequencies, power requirements, and protocols. Developing cost-effective IoT solutions requires a smart, organized approach to radio and antenna integration within a design flow that may have little to do with traditional RF product ... » read more

800G Ethernet MACsec Integration And Verification

By Cadence - 25 Aug, 2021 - Comments: 0

Ethernet is the interconnect technology of choice for a wide range of applications including (but not limited to) data centers, wireless backhaul, automotive, artificial intelligence (AI), and many other use cases. It is ubiquitous. As bandwidth requirements continue to scale to ever-dizzying heights due to the proliferation of data-intensive applications, developing, integrating, and validatin... » read more

5G Communications

By Cadence - 04 Aug, 2021 - Comments: 0

This white paper examines the recent advances that the modeling, simulation, and design automation capabilities in Cadence® AWR® software are helping designers develop the antenna and RF front-end components that are making 5G a reality. This primer offers a breadth of application notes on the innovative wizards and synthesis technologies that enable engineers designing 5G communications syst... » read more

RF To Millimeter-Wave Front-End Component Design Trends For 5G Communications

By Cadence - 28 Jul, 2021 - Comments: 0

This white paper discusses design challenges and solutions related to the "third wave" of communications, presenting several case studies in which the Cadence AWR Design Environment platform has been used to develop products for 5G and beyond. Examples include a multiband active antenna tuner for cellular internet of things (IoT) machine-type communications (mMTC) applications, a linear power a... » read more

AiP/AiM Design For mmWave Applications — Advanced RF Front-End Design Flows From Concept To Signoff

By Cadence - 08 Jul, 2021 - Comments: 0

System requirements for broad bandwidth, millimeter-wave (mmWave) spectrum, phased arrays, and integrated antennas and front-ends are evolving. The challenge for engineers will be achieving the cost, size, and performance requirements that will make these products commercially viable. All these factors align to drive next-generation component integration, which includes embedding the antenna wi... » read more