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Case Study — 3D Wire Bond Inspection and Metrology


The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways. CyberOptics addressed the need for an automated solution to replace labor-intensive and imprecise manual inspection methods for wire bonds and loop heights. After consideration of competitive products, ... » read more

Case Study — Deep Learning For Corner Fill Inspection And Metrology On Integrated Circuits


CyberOptics utilized deep learning to accurately inspect the corner fill on integrated circuits (ICs) produced by a large memory supplier. Traditional methods of inspection showed limitations in their ability to entirely detect the presence and absence of fill, indicating that a more advanced approach was necessary. CyberOptics drew on its large pool of algorithm and neural network expertise to... » read more

Industrial Radiography — CT Scanning for Metrology Applications


Xray technology, more specifically computed tomography (CT), has been adapted for use as an instrument of industrial metrology. Early adopters have quickly recognized the benefits of internal and external nondestructive testing for 3D defect detection and geometric analysis, while those considering adoption may be uncertain how to implement the technology effectively. This study was conducted t... » read more

Addressing High Precision Automated Optical Inspection Challenges With Unique 3D Technology Solution


Driven by the continued decrease in the size of electronics packaging, combined with the increase in density, there is a critical need for highly accurate 3D inspection for defect detection. Using multi-view 3D sensors and parallel projection, it is possible to capture more of the board at a faster rate as compared to serial image acquisition, which is more time consuming. Precise 3D image r... » read more

In-Line Airborne Particle Sensing Supports Faster Response To Contamination Excursions


Fine particles (less than 5 micrometers in diameter) do not affect most industrial processes, but they can have a disastrous impact on semiconductor manufacturing. From the earliest days, manufacturing facilities have deployed air filtering and recirculation to remove particles from the cleanroom, but particles may still be generated inside process tools, where they can cause defects and yield ... » read more

Case Study: Monitoring Humidity To Reduce Reticle Haze Effects


Understanding reticle haze: Without proper control measures, immersion technology scanners are affected by an adverse phenomenon called “haze.” Haze is caused by a combination of three specific factors: Click here to continue reading. » read more

Resolving Particle Issues In Photolithographic Scanners


Case Study: It’s essential to quickly identify the source of airborne particles in photolithographic scanners — both to coordinate and confirm the effects of cleanings and repairs. Regrettably, most traditional methods for detecting particles have trouble addressing particle issues proactively. Consider in-situ methods as an example. Conventional in-situ scanners do not provide access to... » read more

NanoResolution MRS Sensor: Fast, Precise 3D Inspection And Measurement for Advanced Semiconductor Packaging Applications


The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels to achieve faster connections, higher bandwidth and lower power consumption. As packaging technologies have evolved, manufacturers have adapted old processes and adopted new processes to connect chips to each other and to the outside world. Often these new process... » read more

Case Study – Socket Metrology


From hours to seconds, the SQ3000 CMM optimized our customer’s backend inspection and socket metrology cutting cost and increasing yields for their high-volume manufacturing.Our customer was leveraging a Coordinate Measurement Machine (CMM) to handle the intricate measurements required for their socket metrology, semiconductor jigs and mobile phone sensors. Click here to continue reading. » read more

NanoResolution MRS Sensor Delivers Fast, Precise 3D Inspection And Measurement For Advanced Semiconductor Packaging Applications


The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels to achieve faster connections, higher bandwidth and lower power consumption. As packaging technologies have evolved, manufacturers have adapted old processes and adopted new processes to connect chips to each other and to the outside world. Often these new process... » read more

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