Author's Latest Posts

Opposites Attract: IP Standardization vs. Customization
By eSilicon - 25 Sep, 2019 - Comments: 0

Have you had a look lately at an autonomous driving SoC? Have you noticed, besides the cool machine learning stuff, the grocery list of third-party IP that goes into it? It is a long, long list, composed of pieces both big and small and quite diverse. For example, interface and peripheral PHYs and controllers, memories, on-chip interconnects, PVT monitors and PLLs. In some highly-publicized exa... » read more

Chiplets: Open Market or Joint Venture?
By eSilicon - 21 Aug, 2019 - Comments: 1

By Dr. Carlos Macián, senior director AI Strategy & Products, eSilicon Corporation “It may prove to be more economical to build large systems out of smaller functions, which are separately packaged and interconnected.” — Gordon Moore, 1965 “Chiplet” has become a buzzword and like most of its kind, the success of the buzzword predates the widespread availability of the produ... » read more

Meeting The Demands Of PAM4 Systems At 56Gbps And Beyond
By eSilicon - 24 Jul, 2019 - Comments: 0

According to an IDC white paper sponsored by Seagate the global datasphere will grow from 33 zettabytes (one zettabye = one trillion gigabytes) in 2018 to 175 zettabytes by 2025. This white paper also reports that today, more than 5 billion consumers interact with data every day. By 2025, that number will be 6 billion, or 75 percent of the world’s population. Figure 1 depicts this exponential... » read more

Speeding 5G Network Infrastructure Design
By eSilicon - 29 May, 2019 - Comments: 0

As the world becomes more connected and digital, the need for more data and higher speed is evident. The increase in global internet traffic, along with decentralization of cloud and data centers, has driven wired and wireless networks to support 5G network infrastructures. 5G technology promises to enable 1,000 times more traffic, 10 times faster speed and a 10 times increase in throughput. Th... » read more

Why 56Gb/s And 112Gb/s SerDes Matter In Our Daily Social-Media-Driven Lives
By eSilicon - 27 Feb, 2019 - Comments: 0

Hyper-scalers and service providers are moving from 100GbE to 400GbE Ethernet rates and beyond. Wireline and wireless networks are driving new architectures to support the move from 4G LTE to 5G infrastructure. These transitions are driven by the increasing global IP traffic as the world becomes more connected and digital. At the same time, the decentralization of the cloud and data centers are... » read more

Realizing the Benefits of 14/16nm Technologies
By eSilicon - 31 Jan, 2019 - Comments: 0

The scaling benefits of Moore’s Law are challenging below 28nm. It is no longer a given that the cost per gate will go down at process nodes below 28nm, e.g., 20nm though 14nm and 7nm. Rising design and manufacturing costs are contributing factors to this trend. Meanwhile, the competing trend of fewer but more complex system-on-chip (SoC) designs is reducing the knowledge base of many chip... » read more

Why 56Gb/s And 112Gb/s SerDes Matter In Our Daily Social-Media-Driven Lives
By eSilicon - 28 Nov, 2018 - Comments: 0

Hyper-scalers and service providers are moving from 100GbE to 400GbE Ethernet rates and beyond. Wireline and wireless networks are driving new architectures to support the move from 4G LTE to 5G infrastructure. These transitions are driven by the increasing global IP traffic as the world becomes more connected and digital. At the same time, the decentralization of the cloud and data centers are... » read more

eSilicon 7nm SerDes Hits 56Gbps
By eSilicon - 24 Oct, 2018 - Comments: 0

ASIC provider eSilicon focuses on high-performance devices for communications infrastructure, networking, and other data-center applications. Using 7nm TSMC pro- cess technology, it has developed ASIC-design platforms under the NeuASIC brand. Each platform includes hard and soft macros for networking applications along with a new architecture and intellectual-property (IP) library for building ... » read more

The New Deep Learning Memory Architectures You Should Know About
By eSilicon - 22 Aug, 2018 - Comments: 0

Artificial intelligence (AI) has come a long way. While our parents grew up with the dream to one day roam with robots, today we are interviewing Sophia, a citizen of Saudi Arabia, who is also the first humanoid robot to be granted a citizenship in any country. Deep learning, a brain-inspired discipline of AI has been around for a long time but has only recently taken off due to abundant data, ... » read more

Multi-Die Packaging And Thermal Superposition Modeling
By eSilicon - 25 Apr, 2018 - Comments: 0

Packaging density, electrical performance and cost are the primary factors driving electronic package architectures for high-performance server markets. Considerations such as thermal performance and mechanical reliability are equally important but tend to be addressed later in the design cycle. Presented in this paper is a historical view of the packaging trends leading to the current multi-di... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy