Author's Latest Posts


Week In Review: Design, Low Power


Arm and Intel Foundry Services inked a multi-generation agreement to enable chip designers to build Arm-based SoCs on the Intel 18A process. The initial focus is mobile SoC designs, but the deal allows for potential expansion into automotive, IoT, data center, aerospace, and government applications. IFS and Arm will undertake design technology co-optimization (DTCO) to optimize chip design and ... » read more

Blog Review: April 12


Cadence's Ericles Sousa describes the five critical features of automotive SoC architectures that are essential for developing the next generation of passenger vehicles. In a podcast, Siemens' Steph Chavez chats with Gerry Partida of Summit Interconnect about the difficulties in collaboration between PCB designers and manufacturers, along with best practices that designers should follow to r... » read more

Research Bits: April 10


Meminductor identified Researchers at Texas A&M University identified the meminductor circuit unit. Similar to the memristor and the memcapacitor, a meminductor has a memory-like nature where its properties are dependent on previous values. The resistor, capacitor, and inductor comprise the three classical circuit elements. The memristor and the memcapacitor, while earlier theorized, ha... » read more

Week In Review: Design, Low Power


MLCommons debuted the latest results for the MLPerf Inference v3.0 and Mobile v3.0 benchmark suites, which measure the performance and power-efficiency of applying a trained machine learning model to new data in data center, edge, and mobile use cases. Overall, MLCommons said the results showed both power efficiency improvements and significant gains in performance in some benchmark tests. Seve... » read more

Blog Review: April 5


Synopsys's Gordon Cooper argues that AI transformer models, initially developed for natural language processing such as translation and question answering, are starting to make inroads in the computer vision application landscape and changing the direction of deep-learning architectures. Siemens' Patrick Hope shows how to identify opportunities to optimize a PCB design through the creation o... » read more

Startup Funding: March 2023


Funding was broadly spread between sectors in March, with automotive edging ahead thanks to a more than $100 million round for a company manufacturing electric, autonomous heavy commercial trucks for freight logistics. To keep up with the amount of information presented by cars and ADAS, several companies raised funds for head-up displays with increasing levels of detail and expanded fields of ... » read more

Research Bits: April 4


Wet-like plasma etching Researchers from Nagoya University and Hitachi developed a new etch method called wet-like plasma etching that combines the selectivity of wet etching with the controllability of dry etching. The researchers say the technique will make it possible to etch complex structures such as metal carbides consisting of titanium (Ti) and aluminum (Al), such as TiC or TiAlC, wh... » read more

Blog Review: March 29


Siemens' Heather George suggests adopting a shift-left strategy for complex designs that integrate multiple dies into a package and examines the challenges and opportunities for performing comprehensive tests on 2.5D and 3D IC designs. Synopsys' Shekhar Kapoor notes that when considering whether a system will perform as intended, techniques that work well for monolithic SoCs may not be as we... » read more

Blog Review: March 22


Siemens EDA's Dan Yu warns that the unavailability of verification data is slowing down the development of advanced machine learning for verification, with valuable data assets either siloed among different team members or projects or simply discarded due to the lack of analytic techniques to extract value from them. Synopsys' Richard Solomon and Dana Neustadter point to the need for hardwar... » read more

Research Bits: March 21


Micropatterning with sugar A scientist at the National Institute of Standards and Technology (NIST) discovered a transfer printing process that can deposit microcircuit patterns on curved and textured surfaces using sugar candy. Transfer printing methods, such as flexible tapes, are often used for surfaces that are difficult to directly print on. But they have difficulty with conforming to ... » read more

← Older posts Newer posts →