Blog Review: May 17

Ethernet security; PCB reuse; print functions; flash lidar; standards on the horizon.


Synopsys’ Dana Neustadter examines the key industries driving Ethernet security, challenges to securing Ethernet networks, and the MACsec protocol that guards against network data breaches by encrypting data traffic between Ethernet-connected devices.

Siemens’ Stephen Chavez points to the improvements gained from design reuse in PCB design but warns that inefficient processes for managing and sharing data can be a roadblock.

Cadence’s Kirti Sikri introduces the different print functions in the Cadence SKILL functional programming language and the applications where they are used.

Ansys’ Kerry Herbert checks out flash lidar, a compact single beam and two-dimensional grating system that is well suited for consumer electronics.

The ESD Alliance’s Bob Smith chats with Accellera chair Lu Dai about the importance of standards, the organization’s greatest standards successes, and what new standards are in the queue to be ratified and adopted.

Renesas’ Naoto Kashiwazaki checks out how to enable sensorless field oriented control at all speeds, which can have benefits for power consumption but requires an understanding of the type and features of the motor.

Arm staff writers announce the addition of Arm Cortex-A55 CPU IP to the Flexible Access for Startups program, along with an introduction to several companies using the program and an opportunity in a new competition for startups.

Intel’s Ram Krishnamurthy examines a digital approach to in-memory computing called compute near last level cache (CNC) that, instead of moving data from memory to the cores, augments last level cache with parallel compute units.

And don’t miss the blogs featured in the latest Low Power-High Performance newsletter:

Synopsys’ Manuel Mota looks at ensuring the reliability of multi-die systems with UCIe test and repair.

Fraunhofer IIS EAS’ Björn Zeugmann and Olaf Enge-Rosenblatt explain why custom circuit design is so important for smart manufacturing.

Arm’s Mark Knight digs into why mitigating certain threats requires a fundamental change to the familiar model of computer security that relies on a hierarchy of privilege levels.

Rambus’ Frank Ferro explains why memory throughput speed and low latency are critical as inference shifts from the data center to the network edge.

Ansys’ Akanksha Soni shows how heat transfer, electromigration, stress and strain, and thermal expansion pose challenges for stacked dies.

Cadence’s Veena Parthan points to a geometric concept that helps shorten the time to create an accurate mesh.

Siemens EDA’s Janet Attar looks at bringing real route information and parasitics to any step in the place-and-route flow.

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