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Research Bits: May 3


Fingerprinting quantum noise Scientists from the University of Chicago and Purdue University propose a different method of understanding the effect of noise in quantum computers. Instead of trying to measure it directly, they created a 'fingerprint' of how the noise impacts a program run on the computer. “We wondered if there was a way to work with the noise, instead of against it,” sai... » read more

Week In Review: Design, Low Power


Arm unveiled the Arm Cortex-M85 processor and expanded Arm Virtual Hardware to more platforms, including 3rd party devices. The Cortex-M85 is the highest performance Cortex-M processor to date, with 30% scalar performance uplift compared to the Cortex-M7, technology to support endpoint ML and DSP workloads, and includes Pointer Authentication and Branch Target Identification (PACBTI), a new arc... » read more

Blog Review: April 27


Siemens' Joseph Dailey and Jake Wiltgen dispel misunderstandings around safety qualification of software tools and point to some of the safety issues that could lead to schedule delays and additional costs. Synopsys' Mark Kahan explains the testing that went into creating parts of the James Webb Space Telescope and key questions that were asked to ensure the mission could be successful even ... » read more

Research Bits: April 26


Photonic quantum computers Researchers from Stanford University propose a simpler design method for photonic quantum computers. The proposed design uses a laser to manipulate a single atom that, in turn, can modify the state of the photons via a phenomenon called “quantum teleportation.” The atom can be reset and reused for many quantum gates, eliminating the need to build multiple distinc... » read more

Week In Review: Design, Low Power


Tools & IP Synopsys unveiled a new neural processing unit (NPU) IP and toolchain. DesignWare ARC NPX6 NPU IP scales from 4K to 96K MACs with power efficiency of 30 TOPS/Watt. A single instance offers 250 TOPS at 1.3 GHz on 5nm processes in worst-case conditions, or up to 440 TOPS by using new sparsity features, which can increase the performance and decrease energy demands of executing a n... » read more

Blog Review: April 20


Cadence's Paul McLellan looks at the difference between 3D packaging and 3D integration and the different approaches to system-in-package designs. Siemens' Spencer Acain finds that despite having less precision and flexibility than digital chips, analog computing is having a resurgence in the space of cutting-edge AI thanks to the speed and energy efficiency in specialized tasks. Synopsys... » read more

Research Bits: April 19


Processor power prediction Researchers from Duke University, Arm Research, and Texas A&M University developed an AI method for predicting the power consumption of a processor, returning results more than a trillion times per second while consuming very little power itself. “This is an intensively studied problem that has traditionally relied on extra circuitry to address,” said Zhiy... » read more

Week In Review: Design, Low Power


Ansys will acquire cloud simulation provider OnScale. OnScale's technology will be used to provide a cloud-native, web-based UI for device-independent access to Ansys’ simulation technologies as well as creation of simulation-based vertical applications. “OnScale’s cloud-native technology combines the limitless compute power of cloud supercomputers with an intuitive web-based front end, m... » read more

Research Bits: April 13


Washable battery Researchers from the University of British Columbia developed a washable, flexible, and stretchable battery. “Wearable electronics are a big market and stretchable batteries are essential to their development,” said Dr. Ngoc Tan Nguyen, a postdoctoral fellow at UBC’s faculty of applied science. “However, up until now, stretchable batteries have not been washable. Th... » read more

Blog Review: April 13


Synopsys' Scott Durrant, Priyank Shukla, Mitch Heins, and Jigesh Patel provide a brief overview of the history of copper and optical interconnects used in data centers, the limitations of existing interconnect solutions, and the future of co-packaged optics. Siemens' Trey Reeser finds that it's not only necessary for semiconductor companies to address the safety and security of products for ... » read more

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