Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

Notes From The Chip Beat
By Mark LaPedus - 18 May, 2017 - Comments: 0

Over the last several months, I’ve attended a number of conferences, such as IEDM, SPIE, the FD-SOI Summit and others. At each conference, there is a dizzying amount of information and data. Eventually, some information turns into an article, while most ends up buried in a reporter’s notebook. In any case, here are five observations I’ve made, based on those and other events in the pa... » read more

200mm Crisis?
By Mark LaPedus - 18 May, 2017 - Comments: 7

Over the last year or so, the IC industry has experienced an acute shortage of both 200mm fab capacity and 200mm equipment amid a surge of demand for certain chips. Right now, though, the 200mm shortfall is much worse than before. But this situation isn’t expected to improve for both elements in the second half of 2017, and perhaps beyond. On the capacity front, chipmakers are generally... » read more

Manufacturing Bits: May 16
By Mark LaPedus - 16 May, 2017 - Comments: 0

Musical learning chips Imec has demonstrated a neuromorphic chip. The brain-inspired chip, based on OxRAM technology, has the capability of self-learning and has been demonstrated to have the ability to compose music. Imec has combined state-of-the-art hardware and software to design chips that feature these characteristics of a self-learning system. Imec’s goal is to design the process t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 12 May, 2017 - Comments: 0

Market research Intel held a slim 4% lead over Samsung for the number one position in terms of chip sales in the first quarter, according to IC Insights. But as reported, Samsung is on pace to displace Intel as the world’s largest semiconductor supplier in the second quarter, according to the firm. Meanwhile, in the ranking, SK Hynix and Micron made the biggest moves. And there was one new e... » read more

Manufacturing Bits: May 9
By Mark LaPedus - 09 May, 2017 - Comments: 0

China’s quantum computer In its latest achievement, China has built a quantum computer. With its technology, the University of Science and Technology of China and Zhejiang University claimed to have set two records in quantum computing. In classical computing, the information is stored in bits, which can be either a “0” or “1”. In quantum computing, information is stored in quant... » read more

Wirebond Technology Rolls On
By Mark LaPedus - 08 May, 2017 - Comments: 2

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The semiconductor industry today uses several advanced packaging types, but wire bonding has been reinvented over the years and remains the workhorse in packaging. For example, Advanced Semiconducto... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 May, 2017 - Comments: 0

Fab tools, test and packaging Brewer Science has sold its so-called Cee semiconductor processing equipment business. A former employee, Russ Pagel, has formed a new company, Cost Effective Equipment, to take over ownership and operate the Cee business. The new company, which will remain in Rolla, Mo., will sell spin coaters, bake plates, bonders and other systems. Taiwan’s Ministry of E... » read more

Manufacturing Bits: May 2
By Mark LaPedus - 02 May, 2017 - Comments: 0

Patterning 1nm features The Center for Functional Nanomaterials (CFN) at the Brookhaven National Laboratory has patterned features down to 1nm using a direct-write lithography technique. Using a scanning transmission electron microscope (STEM), researchers have patterned thin films of the polymer poly(methyl methacrylate), or PMMA, down to 1nm with a spacing between features at 11nm. Re... » read more

Inside Lithography And Masks
By Mark LaPedus - 01 May, 2017 - Comments: 1

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="IMEC"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cov... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Apr, 2017 - Comments: 0

Chipmakers United Microelectronics Corp. (UMC) has expanded its process portfolio within its joint fab venture in China. The Taiwan government has approved UMC’s application to license its 28nm technology to its subsidiary company in China--United Semiconductor. The subsidiary has been ramping up 40nm technology. “This licensing approval will help Fab 12X to ramp its manufacturing scale, e... » read more

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