Blog Review: Aug. 10

Siemens’ Heather George provides a primer on 3D IC, including the problems it is trying to solve, what differentiates it from other multi-chip technologies, and some of the unique challenges in 3D integration.

Cadence’s Paul McLellan shares highlights from the Automobil Elektronik Kongress, including how the increasing amount of software in a car is driving disruption in the automotive supply chain and the challenge of maintaining a differentiated brand when its necessary for companies to collaborate.

A Synopsys writer notes that while the world is dazzled by the new images coming from the recently-launched James Webb Space Telescope, its predecessor the Hubble Space Telescope will continue observations with its unique array of sensors.

University of Arizona’s Daewook Kim and Ansys’ Erik Ferguson explore how structural and optical simulation software are used in the design, fabrication, and testing of the next generation of telescope optics that will power ground-based systems like the Giant Magellan Telescope and future space-based concepts like the proposed OASIS space observatory.

A Rambus writer highlights what’s new in the latest Compute Express Link (CXL) 3.0 standard, including boosting data rates to 64 GT/s using PAM4 signaling, multi-tiered switching which enables the implementation of switch fabrics, and peer-to-peer direct memory access and enhancements to memory pooling.

The ESD Alliance’s Bob Smith chats with Sashi Subramanian of Cadence about the development of a protocol for use with software license management systems to provide strong protection against piracy by defining how servers can be uniquely identified.

Plus, catch up on the blogs featured in the latest Automotive, Security & Pervasive Computing and Test, Measurement & Analytics newsletters:

Rambus’ Stuart Kincaid looks at the importance of meeting security standards in IC components before integration.

Riscure’s Jasper van Woudenberg shows how an attack can apply to other algorithms.

Analyst Anand Joshi foresees that full speech recognition will require fundamental innovations that allow processing at very high performance per watt.

Siemens EDA’s Amir Attarha examines how to make the power analysis flow more efficient by performing experiments early.

Synopsys’ Ron DiGiuseppe scrutinizes what’s needed to develop chips and systems for automotive applications.

Cadence’s Paul McLellan breaks down the new reality of delivering cars at the speed of consumer electronics.

Infineon’s Danie Schneider concludes that when connected and equipped with sensors and AI capabilities, machines can cooperatively work with people.

Siemens’ Martin Keim examines what’s needed to effectively test 3D-ICs.

Onto Innovation’s Miki Banatwala observes that cloud adoption is about discovering the underlying patterns and the necessary infrastructure frameworks.

Synopsys’s Nozar Nozarian contends that as system complexity grows, so does the difficulty of correctly configuring the software stack.

Teradyne’s David Vondran looks at enabling mmWave with antenna-in-package.