Chip Industry Week In Review

JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it's not possible to choose the best chiplet for a particular application or workload. The guidelines ... » read more

Chip Industry’s Technical Paper Roundup: Dec 11

New technical papers added to Semiconductor Engineering’s library this week. [table id=174 /] More ReadingTechnical Paper Library home » read more

How Different Metal Depositions Affect The Structure And Charge Transport Of 9-A Graphene Nanoribbons

A technical paper titled “Contact engineering for graphene nanoribbon devices” was published by researchers at University of Arizona, Swiss Federal Labs for Materials Science and Technology, University of California Berkeley, Stanford University, SRM Institute of Science and Technology, Texas A&M University, Lawrence Berkeley National Laboratory (LBNL), Max Planck Institute for Polymer... » read more

Chip Industry’s Technical Paper Roundup: July 12

New technical papers recently added to Semiconductor Engineering’s library: [table id=117 /] (more…) » read more

A Design Architecture For Optically Broadband Programmable PICs Utilizing Micromechanical Resonances 

A technical paper titled “Synchronous micromechanically resonant programmable photonic circuits” was published by researchers at The MITRE Corporation, Massachusetts Institute of Technology, Sandia National Laboratories, University of Arizona, and Brookhaven National Laboratory. Abstract: "Programmable photonic integrated circuits (PICs) are emerging as powerful tools for the precise ... » read more

A Glimpse Into Deep Space With Extreme Optical Engineering

By Daewook Kim and Erik Ferguson In the past few decades, optical science has pushed far beyond the foundations originally laid by Galileo and Newton 400 years ago. The planned deployment of new ground- and space-based telescopes dedicated to seeing farther into deep space in more detail than ever before will provide astronomers with increased opportunities to find Earth-like exoplanets and ... » read more

Blog Review: Aug. 10

Siemens' Heather George provides a primer on 3D IC, including the problems it is trying to solve, what differentiates it from other multi-chip technologies, and some of the unique challenges in 3D integration. Cadence's Paul McLellan shares highlights from the Automobil Elektronik Kongress, including how the increasing amount of software in a car is driving disruption in the automotive suppl... » read more

Technical Paper Round-up: April 26

Find all technical papers in Semiconductor Engineering’s library. [table id=23 /]   Semiconductor Engineering is in the process of building this library of research papers.  Please send suggestions for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a ... » read more

Stress tensor mesostructures for deterministic figuring of thin substrates

New research paper from MIT and University of Arizona, funded by NASA. Abstract "Accessing the immense value of freeform surfaces for mass-sensitive applications such as space optics or metaform optical components requires fabrication processes that are suited to figuring thin substrates. We present stress tensor mesostructures for precisely correcting figure errors, even after microstruc... » read more

Power/Performance Bits: Jan. 18

3D printed custom wearables Researchers from the University of Arizona created a 3D printed wearable that can operate continuously through wireless power to track body temperature and muscle deformation during exercise. Based on 3D body scans of the wearer, the medical-grade 'biosymbiotic device' can be custom printed to conform to a user's skin without the need for adhesives, which can irr... » read more

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