Blog Review: Aug. 23

Siemens’ Stephen Chavez discusses best practices when it comes to thermal analysis for PCB design, including component placement and close collaboration between mechanical and electrical engineering disciplines.

Synopsys’ Gary Ruggles, Richard Solomon, and Varun Agrawal introduce the Compute Express Link (CXL) specification and how it could help improve latency through computational offloading and memory pooling.

Cadence’s Paul Scannell suggests that 3D-ICs need an intelligent way to do top-level aggregation and abstraction for the entire system, taking into account bump planning, interconnect optimization, and the placement of chiplets on the package substrate.

Ansys’ Mike Howard argues for using a ‘design for excellence’ approach that uses the knowledge and experience of experts in other parts of the product development process to ensure the final product can be realized at reasonably low life cycle cost while still meeting reliability, quality, durability, and customer expectation targets.

Rambus’ Joe Rodriguez notes that the MIPI Alliance and the Automotive SerDes Alliance (ASA) have announced an agreement that will ultimately enable MIPI CSI-2 controllers to interface directly with ASA Motion Link (ASA-ML) PHYs.

Arm’s Yibo Cai shows how to add Arm Scalable Vector Extension (SVE) support to xsimd, an open-source SIMD library, along with how to port existing SIMD code to SVE.

In a blog for SEMI, Glencoe Strategies’ Scott Stone and Tokyo Electron’s Colin Brough discuss the growing legal and regulatory risks facing the semiconductor industry and how to navigate those risks through the pursuit of sustainability strategies and broader industry collaboration on policy development.

Renesas’ Ryutaro Minesawa, Yasuhiko Ochiai, and Shinya Ishida examine EV charging station market trends and optimal semiconductors for DC charging stations.

Keysight’ Scott Register points out the new U.S. consumer IoT cybersecurity labeling program that aims to enable consumers to make more informed decisions when selecting a connected device.

Codasip’s Mike Eftimakis considers whether fragmentation will hinder RISC-V and cases where a designer will want ISA-dependent code.

Plus, check out the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Editor In Chief Ed Sperling points to some less obvious challenges in heterogeneous designs.

Technology Editor Katherine Derbyshire examines the buzz around maskless lithography.

Amkor’s Vik Chaudhry explains why it is important to have a clear definition of who is supplying what to whom and how to resolve issues.

SEMI’s Gity Samadi and Paul Semenza look at applying additive manufacturing techniques to semiconductor and electronics packaging.