Top Tech Videos of 2023

In 2023, heterogeneous integration, RISC-V, and advanced node logic scaling and advanced packaging dominated the semiconductor industry. All of those topics spurred deep discussions at conferences, and they were the subject of Semiconductor Engineering's most popular videos. Of the videos published in 2023, here are the highlights from our five channels: Manufacturing, Packaging & Mater... » read more

Blog Review: November 15

Cadence's Neelabh Singh explores the process of lane initialization and link training in bringing up a high-speed link in USB4. Synopsys' Shela Aboud argues that TCAD should be an integral part of an EDA flow as it enhances design technology co-optimization with a way to experiment and determine what works and what doesn’t work at different process nodes using physics-based models. Siem... » read more

Blog Review: Nov. 8

Siemens' Todd Westerhoff takes a look at the three stages of power integrity analysis for PCBs, challenges to board-level signal integrity, and best practices for getting the most accurate estimate of design performance. Synopsys' William Ruby provides a brief overview of the evolution of low-power design techniques and finds opportunities to reduce power and to make chip designs more energy... » read more

Coding And Debugging RISC-V

As monolithic device scaling continues to wind down and evolve toward increasingly heterogeneous designs, it has created an inflection point for chip architects to create customized cores that are much more energy efficient and faster than off-the-shelf processors. Zdeněk Přikryl, CTO of Codasip, talks about where RISC-V fits into this picture, using a modular ISA and custom instruction layer... » read more

Chip Industry Week In Review

By Susan Rambo, Gregory Haley, Jesse Allen, and Liz Allan President Biden issued an executive order on the “Safe, Secure, and Trustworthy Development and Use of Artificial Intelligence.” It says entities need to report large-scale computing clusters and the total computing power available, including “any model that was trained using a quantity of computing power greater than 1,026 inte... » read more

Causes Of Memory Unsafety

Memory unsafety is a characteristic of many of today’s systems. The root cause of buffer bounds vulnerabilities such as buffer overflows and over-reads is unsafe programming. Major software vendors consistently report memory unsafety problems. For example, the Chromium open-source browser project has stated that 69% of CVEs (Common Vulnerabilities and Exposures) reported relate to memory... » read more

FIR And Median Filter Accelerators In CodAL

5G is the latest generation of cellular networks using the 3rd Generation Partnership Project (3GPP) 5G New Radio air interface. Unlike previous generations of network (2G, 3G & 4G) which had a one-size-fits-all approach, 5G aims to address a wide range of very different applications. To flexibly support diverse quality of service requirements, network slicing is introduced to enable mul... » read more

Blog Review: October 25

Synopsys’ Graham Allan looks at enhancements in the LPDDR5X standard, such as a speed increase from 6.4Gbps to 8.5Gbps using the same 1.1V core voltage as LPDDR5 alongside better signal integrity, reliability, and battery efficiency. Cadence’s Krunal Patel examines the essential components and operation of MACsec, a security protocol to ensure the confidentiality and integrity of data tr... » read more

Chip Industry Week In Review

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Blog Review: October 18

Siemens' Stephen Chavez suggests including analog mixed signal analysis and board level parasitics within the design process from the earliest electrical design stage and throughout final release of the PCB design. Synopsys’ Filip Thoen, Leonard Drucker, and Vivek Prasad highlight how the complexities and interdependencies of multi-die systems create new challenges for software bring-up, a... » read more

← Older posts