Blog Review: December 13

BLE opportunities; USB4 links; mixed-signal verification; ReRAM on-chip memory.


Synopsys’ Charles Dittmer discusses key and emerging use cases for Bluetooth Low Energy and how combining BLE with other wireless protocols can open new avenues of functionality for application areas including automotive, hearables, and retail.

Cadence’s Neelabh Singh points out changes in the terminologies describing USB4 links and shows the various possible link configurations put forth by the latest version of the specification.

Siemens’ Sumit Vishwakarma argues that traditional mixed-signal verification solutions that assume that analog and digital portions of the design can be verified separately are inadequate for today’s complex and highly integrated mixed-signal ICs.

Lam Research’s Brett Lowe investigates whether ReRAM could be used as an on-chip memory to replace SRAM to meet the size requirements of machine learning, image processing, and other advanced CPU applications.

Keysight’s Emily Yan notes that the cost-effectiveness of IP reuse is improved by documenting both technical metrics, such as power optimization and area efficiency in the final design, and non-technical metrics, such as integration efforts and vendor support.

Renesas’ Giancarlo Parodi discusses several of the decisions the company made in the development of a RISC-V CPU core that is suitable for many different application contexts.

Arm’s Volodymyr Turanskyy highlights improved support for Arm targets in LLVM 17 such as code generation to make use of new architecture extensions and updates to improve performance and security of the resulting code.

Ansys’ Kim Woodham and Laura Carter check out how simulation is being used by companies in the automotive industry to support electrification, ADAS/AV development, and connectivity.

In a podcast, Infineon’s Thomas Reinhardt chats with Peter Sung of Linsation and Julian Kornprobst of Infineon about the rapid evolution of wireless audio technologies and hearables with the integration of sensors such as MEMS microphones.

SEMI’s Cassandra Melvin listens in as industry experts consider whether semiconductor industry growth can remain consistent with a net zero roadmap and why focusing on regional strengths is better than trying to recreate the chip value chain in every region.

Memory analyst Jim Handy considers two conundrums with CXL: its potential impact on memory sales and where it fits in the memory/storage hierarchy.

Amazon’s Sankalp Dayal and Mahdi Heydari delve into the process of optimizing a neural network for special-purpose hardware used in edge devices.

Plus, check out the blogs featured in the latest Auto, Security & Pervasive Computing and Test, Measurement & Analytics newsletters:

Synopsys’ Richard Solomon details why modern vehicles need an interconnect with high bandwidth, extreme reliability, and robust security.

Cadence’s Steve Brown looks at the application of large language models in electronic system design.

Rambus’ Bart Stevens combines a classical cryptographic algorithm with its quantum-safe equivalent.

Renesas’ Andreas Bier outlines the steps involved in turning a wafer into an electronic device.

Siemens’ Lee Harrison demonstrates how newer DFT technology eases AI chip development.

Flex Logix’s Geoff Tate lays out the characteristics of an ideal embedded FPGA.

Infineon’s Vibheesh Bharathan discusses reducing power and size without impacting touch performance.

Onto Innovation’s Ali Burhan shows why manufacturers are seeking inspection solutions with automatic defect classification (ADC) capabilities to perform outgoing quality assurance for wafers.

NI’s James Guilmart explains how off-the-shelf data management and analytics platforms can help accelerate product development and enhance performance.

Synopsys’ Dan Alexandrescu looks at how cutting-edge technology processes, advanced IPs, and complex designs expose automotive IC and solutions providers to risks caused by process variability, aging and degradation.

Advantest’s Ken Butler and Synopsys’ Guy Cortez dig into why semiconductor test engineering is moving toward fully adaptive test where each device receives the “right” test content to assess its correctness.

proteanTecs’ Gal Carmel drills into why monitoring and diagnostic practices need to keep up as the electronic technologies of software-driven vehicles evolve.

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