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Blog Review: Feb. 16

Software side of Morello project; low power for IoT; supply chain challenges.

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Arm’s Mark Nicholson explains the software side of the Morello project to implement a prototype security-focused architecture, presenting a high-level view of the software stacks and discussing the status and roadmap of a range of activities.

Synopsys’ Ron Lowman finds that as IoT technology and capabilities of portable devices expand, the deployment of 5G networks and interest in AI and automation will require teams to invest in improved SoC design and optimization techniques, with a priority on low power and increased battery life.

Siemens’ Oren Manor points to key challenges ahead for the electronics industry, including continued supply chain disruption, global travel limitations, and increased demand from the automotive industry.

Cadence’s Ben Gu finds that mesh generation is critical to accurate and efficient computational simulation, but generating meshes for complex multi-physics problems is a challenging endeavor.

Ansys’ Prith Banerjee looks to how AI can greatly increase the speed of simulation and notes trends such as the importance of good training data, generative AI, and the use of the cloud for collaborative work.

The ESD Alliance’s Bob Smith chats with Azeez Bhavnagarwala of Metis Microsystems about harvesting energy from transient data to improve component performance while also lowering total energy consumption, leading to reductions in the energy-delay product of CMOS logic and memory components.

Semico Research’s Rich Wawrzyniak considers the implications of Intel’s recent announcements embracing the RISC-V architecture and ecosystem on the foundry, EDA, SoC, and SiP markets.

Memory analyst Jim Handy examines the impact the recent contamination issue at Western Digital and Kioxia flash wafer fabrication plants could have on the affected companies and the flash market as a whole.

Intel’s Rao Desineni and Eugene Tuv point to the numerous applications of AI the company is deploying in its manufacturing environment and why there’s still room to grow.

Nvidia’s Isha Salian checks out how researchers are adapting sensors and computer vision technology from the automotive domain for use in healthcare settings to reduce medical errors and improve monitoring of patients’ movement and recovery.

And don’t miss the blogs featured in the latest Low Power-High Performance newsletter:

Arm’s Panch Chandrasekaran examines what will drive 5G adoption.

Fraunhofer’s Dirk Mayer and Ulf Wetzker look at where to get enough data to train useful AI models for industrial processes.

Siemens’ Neel Natekar proposes a different approach to ESD verification.

Synopsys’ Geetha Rangarajan highlights AI-driven design that benefits projects at mature nodes.

Rambus’ Frank Ferro shows how the latest version of the High Bandwidth Memory standard is keeping up with increasingly demanding applications.

Ansys’ John Lee observes that systems companies are banking on made-to-order, optimized silicon to maintain their competitive advantage.

Cadence’s Veena Parthan explains how computational fluid simulation helps design very fast boats.

ESD Alliance’s Bob Smith points to key innovations that helped shaped the semiconductor industry.



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