Blog Review: Feb. 26

IoT attack surface; low power CPU modes; AR opportunities; what’s new in BLE.


Cadence’s Paul McLellan listens in as Warren Savage of the University of Maryland explains how security threats are increasing as IoT devices broaden the attack surface and why the semiconductor industry needs to take responsibility.

Synopsys’ Taylor Armerding argues that a key first step to complying with new and upcoming consumer privacy laws should be ensuring cybersecurity to protect against breaches.

In a video, Mentor’s Colin Walls explains low power CPU modes for embedded systems and what is involved in using them.

Arm’s Ian Pilkington says that augmented reality is on track for significant growth and explores how five key AR use-cases could manifest in the near future as well as predictions for far-future capabilities.

Imagination’s Shewan Yitayew explains why the new Bluetooth Low Energy 5.2 specification is worth paying attention to, from mandating a more efficient codec to new audio features to support for hearing aids.

University of Arizona’s Emily Dieckman explains why researchers are developing new methods to collect and analyze sweat for clues about how the body is functioning.

Elektrobit’s Dirk Spiesswinkel suggests, in a blog for ANSYS, that adding augmented reality heads-up displays to cars could help pave the way for acceptance of ADAS and autonomous vehicle technology, plus key points in testing AR HUDs.

Lithography blogger Chris Mack shares highlights from the first day of SPIE and points to a major challenge in shrinking pitch to 30nm or 28nm.

Intel’s Carlos Cordeiro points to how Wi-Fi 6 will boost network performance in crowded environments and support the many new devices coinnecting to the Internet and the role of the 6 GHz band.

SEMI’s Nishita Rao chats with Nathan Pretorius of NextFlex about the challenges and opportunities of integrating MEMS with flexible hybrid electronics.

For more good reading, check out these blogs, including from the latest Manufacturing, Packaging & Materials newsletter:

Editor In Chief Ed Sperling examines the good and bad of multi-region manufacturing.

SEMI blogger Walt Custer shows how the new coronavirus has left the entire supply chain scrambling

Lam’s David Haynes explains why upgrading 200mm equipment with advances made at 300mm is a way to quickly improve yield and capacity.

Cree’s Guy Moxey connects the dots of increased demand for high-efficiency power supplies and power conversion systems with manufacturers’ need to keep factory costs down.

Coventor’s Hideyuki Maekoba explains how temperature stability and bandwidth limit existing gyroscope designs, but a promising new architecture could address such challenges.

ClioSoft’s Amit Varde makes the case for why knowing which customers are using what versions of an IP can help catch potential problems and make reuse successful.

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