Blog Review: July 22

AI and 3D; digital photography; PCB manufacturing.


In a video, Synopsys Chairman and co-CEO Aart de Geus discusses AI’s computational wants, how 3DIC technology can infuse vitality into Moore’s Law and drive innovation for the semiconductor industry.

Cadence’s Paul McLellan looks back at the initial rise of digital cameras, the swift decline of the point-and-shoot as smartphones took over, and the development of increasingly complex CMOS image sensors.

Mentor’s Shivani Joshi provides a basic primer on steps to take to ensure PCB manufacturing goes as smoothly as possible and common issues to watch out for.

Arm’s Mohit Aggarwal takes a look at an open-source Python library that aims to improve the process of automating the machine learning pipeline to enable widespread adoption of ML, especially for non-expert users.

Ansys’ Christian Scheiba explains TISAX, a new certification in the automotive industry to ensure the security of data that is stored, processed, and transferred between customers, partners, and suppliers.

In a blog for SEMI, Microchip Technology Philippines’ Greg Fisher explains some of the measures taken during different stages of restriction and quarantine and efforts the company has taken to maintain operations while protecting staff.

Nvidia’s Isha Salian highlights Trefos, a startup using machine learning plus drones equipped with lidar and cameras to create high-resolution 3D maps for forest monitoring and management.

And don’t miss these blogs from the latest Manufacturing, Packaging & Materials newsletter:

Editor In Chief Ed Sperling predicts flexible IC technology will boom, but different substrates and new technologies still need the same kind of predictability and reliability as silicon.

Executive Editor Mark LaPedus sees China making progress on its semi manufacturing, so look out for compound semis, materials and wafers.

Coventor’s Michael Hargrove warns that accurate modeling can avoid yield problems in DRAM and misalignment of 3D NAND.

Brewer Science’s James Lamb digs into the advantages of low-shrinkage spin-on carbon materials for high-temperature PECVD and post-processing.

Cree/Wolfspeed’s Kasyap Patel shares some hardware solutions that mitigate the design challenges and meet requirements of the latest tropospheric scatter applications.

Flex Logix’s Geoff Tate lays out two ways for an SoC to take advantage of FPGA flexibility and the applications where each shine.

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