Regaining The Edge In U.S. Chip Manufacturing


The United States is developing new strategies to prevent it from falling further behind Korea, Taiwan, and perhaps even China in semiconductor manufacturing, as trade tensions and national security concerns continue to grow. For years, the U.S. has been a leader in the development of new chip products like GPUs and microprocessors. But from a chip manufacturing standpoint, the U.S. is losin... » read more

What Happened To Execute-in-Place?


Executing code directly from non-volatile memory, where it is stored, greatly simplifies compute architectures — especially for simple embedded devices like microcontrollers (MCUs). However, the divergence of memory and logic processes has made that nearly impossible today. The term “execute-in-place,” or ”XIP,” originated with the embedded NOR memory in MCUs that made XIP viable. ... » read more

Blog Review: July 22


In a video, Synopsys Chairman and co-CEO Aart de Geus discusses AI's computational wants, how 3DIC technology can infuse vitality into Moore’s Law and drive innovation for the semiconductor industry. Cadence's Paul McLellan looks back at the initial rise of digital cameras, the swift decline of the point-and-shoot as smartphones took over, and the development of increasingly complex CMOS i... » read more

ML Opening New Doors For FPGAs


FPGAs have long been used in the early stages of any new digital technology, given their utility for prototyping and rapid evolution. But with machine learning, FPGAs are showing benefits beyond those of more conventional solutions. This opens up a hot new market for FPGAs, which traditionally have been hard to sustain in high-volume production due to pricing, and hard to use for battery-dri... » read more

Week In Review: Design, Low Power


Tools & IP Cadence unveiled ten two verification IP (VIP) to support hyperscale data centers, automotive, and consumer and mobile applications. The new VIPs include complete bus functional models, integrated protocol checks and coverage models, and a specification-compliant verification plan. The VIPs cover CXL, HBM3, Ethernet 802.3ck, CSI-2 3.0, MIPI I3C 1.1, TileLink, eUSB2, UFS 3.1, MIP... » read more

Memory Issues For AI Edge Chips


Several companies are developing or ramping up AI chips for systems on the network edge, but vendors face a variety of challenges around process nodes and memory choices that can vary greatly from one application to the next. The network edge involves a class of products ranging from cars and drones to security cameras, smart speakers and even enterprise servers. All of these applications in... » read more

SiC Foundry Business Emerges


Several third-party foundry vendors are entering or expanding their efforts in the silicon carbide (SiC) business amid booming demand for the technology. However, making a significant dent in the market will not be so easy for SiC foundry vendors and their customers. They are facing stiff competition from traditional SiC device vendors such as Cree, Infineon, Rohm and STMicroelectronics. ... » read more

Week In Review: Design, Low Power


Rambus finalized its acquisition of the silicon IP, secure protocols and provisioning business from Verimatrix, formerly Inside Secure, for $45 million at closing, and up to an additional $20 million, subject to certain revenue targets in 2020. RISC-V SiFive unveiled two new product families. The SiFive Apex processor cores target mission-critical processors with Size, Weight, and Power (SW... » read more

Week In Review: IoT, Security, Autos


Internet of Things Amazon is expanding its IoT services. Alexa Voice Services will require less processing power on the device, moving from the 100MB of RAM and Arm Cortex A microprocessor to 1MB and an Arm Cortex-M. Amazon will do more of the processing in the cloud, enabling developers to add Alexa to smaller, single purpose devices. “It just opens up the what we call the real ambient inte... » read more

Inspection, Metrology Challenges Grow For SiC


Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it’s becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of a... » read more

← Older posts