Security and isolation; connected mobility; IoT camera vulnerability; connected toys; Bluetooth mesh.
Mentor’s Dan Driscoll digs into designing for safety and security on the Xilinx UltraScale+ MPSoC and the different mechanisms that support subsystem isolation.
Cadence’s Paul McLellan listens in on a talk by Bosch’s Volkmar Denner on the future of communications and AI in connected autos.
Synopsys’ Robert Vamosi points to a recently-discovered vulnerability that could be present in thousands of different security camera models and other IoT devices.
Rambus’ Aharon Etengoff points to warnings by the FBI about the privacy and safety risks present in the increasing number of interactive, internet-connected toys.
ARM’s Jason Hillyard examines the newly-released Bluetooth mesh specification, how it works, and the security features it offers.
A Lam Research staff writer argues that while wireless technology has boomed in recent decades, wired communications won’t be going away any time soon.
A National Instruments writer shares highlights from the Automotive Test Expo with a focus on sensor fusion testing.
Nvidia’s Tony Kontzer profiles a pair of researchers working to fight tuberculosis in developing countries with deep learning technology.
Samsung’s Hubbert Smith compares SSDs with HDDs when sizing storage and performance in data centers.
In a video, Cadence’s Marc Greenberg explains the difference between error correcting code implementation using a traditional sideband architecture and the new in-line ECC used in LPDDR4.
Mentor’s John McMillan looks at specific features in schematic and PCB layout tools that are useful for IoT designs.
And don’t miss the featured blogs from last week’s Manufacturing & Process Technology newsletter:
Editor In Chief Ed Sperling points to a growing lack of redundancy in semiconductor materials and components.
Executive Editor Mark LaPedus zeroes in on the most pressing topics—economics, China, EUV, fan-outs and R&D—at Semicon.
Technical Editor Katherine Derbyshire argues that whether machines solve problems like humans isn’t important.
Applied Materials’ Ganesh Hegde explains how to improve on a successful formula for manufacturing.
Coventor’s Christine Dufour examines how integrated design environments based on PDK and standard cell libraries accelerate MEMS product development.
D2S’ Ryan Pearman drills down on scattering, dose/shape and mid-range correction issues for EUV masks.
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“A Lam Research
staff writer argues that while wireless technology has boomed in recent
decades, wired communications won’t be going away any time soon.”
Wireless is more convenient and convenience always wins in consumer.
The one big weakness for wireless is the lack of power delivery and that’s where the focus should be, wireless power delivery and maybe energy harvesting.