D2S reviews the challenges of mask modeling in the EUV era, including the need for dose/shape separation and mid-range correction, and the impact of GPU acceleration.
Data and protocol interoperability standards are needed for EDA tools, and there are more hurdles ahead. Customized chiplets will be required for AI applications.
The promise of photonics ICs is spurring innovation, but complex processes and a lack of open foundries are keeping it from reaching its full potential.
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