Blog Review: June 7

3D hybrid bonding; vehicle design complexity; hyperthreading; CFD for racecars; sparse functions.


Synopsys’ Kenneth Larsen and Powerchip’s S.Z. Chang explore wafer-on-wafer (WoW) and chip-on-wafer (CoW), 3D hybrid bonding schemes that can be used to stack memory on logic with shorter signal transmission distance at no wasted power and more interconnect and bandwidth density.

In a podcast, Siemens’ Conor Peick, Nand Kochhar, and Mark Sampson chat about how companies can address growing complexity in vehicle design and how the specific needs of autonomous vehicles affect the design and development process.

Cadence’s Veena Parthan considers the restrictions on aerodynamic testing, both in wind tunnels and through CFD simulations, placed on Formula One teams in an effort to level the playing field.

Keysight’s Anda Ioana Enescu Buyruk and Cosmin Chenaru consider how to better optimize CPUs and what to look after when using hyperthreading in high-performance networking or other real-time applications.

Arm’s Chris Armstrong introduces new sparse functions for numerical software in Arm Performance Libraries 23.04, specifically a sparse triangular matrix solve function and functions which operate on sparse vectors.

Ansys’ Federico Duque Gomez introduces diffractive optics, which use periodic microscopic structures to scatter light in one or multiple well-defined directions, and checks out several emerging applications employing the technology.

SEMI’s Krish Dharma shares key metrics and techniques to enhance agility in electronics supply chains and how several companies have implemented digital twins for supply chain optimization.

And don’t miss the blogs featured in the latest Automotive, Security & Pervasive Computing and Test, Measurement & Analytics newsletters:

Siemens’ Dan Yu, Harry Foster, and Tom Fitzpatrick lay out verification challenges that are addressable by ML and the techniques and algorithms that show promise.

Synopsys’ Ron DiGiuseppe takes a deep dive into why the standard is a critical resource for development of the latest generation of automotive SoCs.

Arteris’ Frank Schirrmeister illustrates why automotive computing, sensing, and data transport requirements are growing enormously.

Rambus’ Bart Stevens warns that traditional asymmetric cryptographic methods won’t withstand attacks from quantum computers.

Cadence’s Paul McLellan looks at why OEMs don’t want to let other companies define the driving experience.

Winbond’s William Chen explains why low-temperature soldering (LTS) offers environmental benefits and reduces manufacturing stresses on boards and components.

Infineon’s Danie Schneider outlines bringing together large amounts of data to create intelligent value chains.

Flex Logix’s Jeremy Roberson finds that adapting DSP to changing models comes at a lower cost than using FPGA.

DR Yield’s Krista Tropper digs into why yield data analytics can help identify issues arising in the semiconductor manufacturing process.

Onto’s Mike McIntyre explains how to improve sustainability without impacting yield and throughput.

Synopsys’ Rohan Bhatnagar finds a growing need for more reliable semiconductor chips that can operate under extreme conditions.

Teradyne’s Tom Tran warns that increased power requirements mean more power is being driven through smaller devices.

Nordson’s Muge Deniz Meiller examines the role of fluid dispensing solutions in battery manufacturing.

Advantest’s Toni Dirscherl looks at power management IC test challenges that ATE systems tailored for mostly digital devices cannot address.

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