Blog Review: May 19

Structured ASIC plus EMIB; AI gaps; smart cities’ 5G boost; supply chain defenses.


Cadence’s Paul McLellan checks out a project from Intel and DARPA to combine the eASIC structured ASIC technology with data interface chiplets and enhanced security protection, with manufacturing in the U.S.

In a podcast, Siemens EDA’s Ellie Burns and Michael Fingeroff discuss the gap between what the best AI applications can perform today versus the human brain and the challenges that hardware designers have in their design flow.

Synopsys’ Ron Lowman checks out some examples of smart cities in the making and the further changes that can be expected as 5G networks roll out, including gathering masses of sensor data to manage things from energy use to transportation.

Arm’s Rhiannon Burleigh chats with Basel Halak of the University of Southampton on efforts to develop a defense mechanism against hardware supply chain security attacks, including counterfeiting, and what future research should investigate.

Ansys’ Wim Slagter examines the increased use of cloud computing for simulation and the impact working from home during the COVID-19 pandemic has had on engineering IT priorities.

In a blog for SEMI, Emerald Greig of SurplusGLOBAL finds continued strong demand for semiconductor equipment, and while shortages aren’t new, prices for legacy 150mm and 200mm equipment is expected to rise.

Plus, check out the blogs featured in the latest Low Power-High Performance newsletter:

Fraunhofer’s Andy Heinig predicts that while high-volume chips are expected to recover from recent shortages relatively quickly, small and medium-sized IC orders face a rocky path.

Siemens EDA’s Harry Foster finds demand for FPGA verification engineers is increasing rapidly.

Synopsys’ Joe Mallett sketches out some common design errors involving resets and how to address them.

Rambus’ Joseph Rodriguez looks at how out mobile display requirements have advanced rapidly over the past few years, driving an increased need for video compression.

Arm’s Dennis Laudick explains how power-intensive AI can become an important tool for driving global sustainability.

Cadence’s Raj Pawate walks through the process for updating an audio codec specification’s reference software and basic operators for modern DSP architectures.

Ansys’ Chris South and Theresa Duncan explain how to accurately determine the dynamic behavior of batteries to ensure performance and reliability.

OneSpin’s John Hallman introduces new standards and risk assessment for automotive.

Mixel’s Ashraf Takla explains how the C-PHY specification achieves higher data rates at low transition rate and lower power.

ClioSoft’s Srinath Anantharaman demonstrates how to reduce the cost of re-using IP by tracking relevant information upfront.

Although some gaps still need to be addressed, Calibra’s Jan Willis reports that experts are optimistic about photomasks for curvilinear ILT.

Leave a Reply

(Note: This name will be displayed publicly)