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Blog Review: May 26

The state of AI hardware; hyper-convergent design; PCB creepage.

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Cadence’s Paul McLellan checks out challenges in designing processors for AI applications, the explosion in the number of weights used to language processing, and the current state of training and inference hardware.

Synopsys’ Mike Gianfagna explores how hyper-convergent design will push device capabilities through integration of multiple technologies, multiple protocols, and multiple architectures into one massive, highly complex, and interdependent design.

Siemens EDA’s Larry Stones explains why creepage is an important factor when dealing with high-voltage applications on a PCB design.

Ansys’ Damir Senic details a collaboration with NIST to simulate and create an atom-based sensor that can determine the direction of incoming radio signals, a key technology for more reliable communications.

Arm’s Alexandre Peixoto Ferreira explains how the SMARTER project approached sharing edge computing infrastructure to support multiple users and applications, techniques borrowed from cloud computing, and how it can be used.

The ESD Alliance’s Bob Smith chats with Aki Fujimura of D2S about the difference between Manhattan and curvilinear shapes for photomasks, why curvilinear shapes are now emerging, and where they are likely to be applied.

Nvidia’s Brad Nemire chats with Marco Aldinucci of the University of Torino about the convergence of AI and high-performance computing applications, how to create scalable parallel programs, and applying the techniques to improve medical imaging diagnosis.

And don’t miss the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Executive Editor Mark LaPedus questions how long the flat-panel display party will last.

Amkor’s Prasad Dhond explains how a shortage of wire bonders and substrates has an impact much further down the supply chain.

SEMI’s Inna Skvortsova shines a light on how new technologies that require more processing steps are resulting in higher wafer fabrication and packaging materials consumption.

Lam Research’s Krishnan Shrinivasan examines the impact of faster wireless on everyday applications.

QP Technologies’ Rosie Medina shows how one company addressed the challenges posed by COVID-19.



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