Blog Review: Nov. 23

Automotive challenges; leveraging sensors; JEDEC-UFS challenges; technology transfer; supercomputing for manufacturing; biotech warning; MIPI standards adoption.


Mentor’s Brian Derrick argues that both designers and ecosystems are changing to leverage advances in sensing technology at the edge of the IoT.

Cadence’s Paul McLellan listens in on a DVCon Europe keynote by NXP’s Jürgen Weyer on what automotive is learning from mobile and where the big challenges lie.

Synopsys’ Tumuluri SantoshaLakshmi talks about seven of the biggest challenges in JEDEC-UFS stack verification.

NXP’s Davina Verges discusses technology transfer and how the industries of automotive and connected consumer devices can learn from each other.

Ansys’ Wim Slagter argues that supercomputing will be vital to how engineering and manufacturing enterprises find new ways to improve.

The White House’s Christopher Chyba and Wanda Austin warn that while advanced biotechnology could transform the way the world treats disease, it also has the potential for destructive use.

Rambus’ Aharon Etengoff looks at the predicted growth of mobile payments in the US.

ARM’s Mike Eftimakis checks out recent changes to TrustZone for energy-constrained systems and the CoreLink SSE-200 subsystem.

In a video, Cadence’s Moshik Rubin takes a closer look at industry adoption of of CSI2, DSI, and other common MIPI protocols.

Synopsys’ Richard Solomon urges PCI-SIG members to check out the new 0.7 Draft of PCI Express 4.0. Or at least the first page, which includes the possibility of an important change.

Mentor’s Joe Hupcey III stresses the need to secure the root of trust in IoT devices, and suggests verification methodologies to ensure that secure storage is, indeed, secure.

Plus, check out the blogs featured in last week’s Manufacturing, Design & Test newsletter:

Editor In Chief Ed Sperling looks at why known good die are suddenly important again and how to achieve that.

Executive Editor Mark LaPedus talks with Inpria’s CEO about EUV resist challenges.

Technical Editor Katherine Derbyshire shows why some analyses are so misleading.

National Instruments’ David Vye contends that design trends in high-frequency component integration require a different approach.

Mentor Graphics’ David Abercrombie digs into cut masks and how to comply with a variety of different rules.

Applied Materials’ Selim Nahas explains how to limit the impact of different skill sets and perceptions in semiconductor manufacturing.

Coventor’s Jimmy Gu points to the value of using real-world tools to teach students the latest commercial technologies.

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