Blog Review: September 13

Power and thermal in data centers; signal integrity for PCBs; AI for chip design; IoT innovation; IV characterization.


Siemens’ Todd Westerhoff highlights the importance of signal integrity analysis in PCB design, challenges as simulation tools have become more sophisticated and difficult to use, and best practices like starting with a simple analysis problem.

Synopsys’ Rita Horner, Shekhar Kapoor, and William Ruby note that the power and thermal profiles of multi-die systems for HPC and the data center should be considered and planned for at every stage of the design process.

Cadence’s Reela Samuel listens in as industry experts discuss potential pitfalls of applying generative AI to chip and system design along with the rapidly evolving technology landscape.

Arm’s Parag Beeraka anticipates IoT innovation as more devices become able to incorporate machine learning capabilities without having to be connected to the cloud, providing faster response times and improved privacy.

Keysight’s Shawn Lee examines some of the challenges of current-voltage (IV) characterization and testing for low-power ICs and suggests using a source measure unit capable of serving as both a voltage and current source while simultaneously measuring voltage and current.

Ansys’ Prith Banerjee discusses the role AI and machine learning play in speeding up simulation, including accuracy and what’s next.

Renesas’ Yoshihito Ogawa considers problems that arise in the development of automotive software in an environment which requires the coordinated operation of multiple devices and introduces synchronous logging for the debugging or profiling of systems.

In a blog for SEMI, Advanced Energy’s Vitaly Petrishchev finds that high-speed, precise and repeatable plasma power delivery with sophisticated controls is fundamental to process and device improvements.

Plus, check out the blogs featured in the latest Auto, Security & Pervasive Computing and Test, Measurement & Analytics newsletters:

Synopsys’ Stewart Williams explains the role of virtual prototyping as software becomes a key automotive differentiator.

Rambus’ Bart Stevens looks at an important milestone for key encapsulation mechanisms and digital signature algorithms.

Siemens’ Wilfried Wessel and Florian Bauer, and the University of Applied Sciences Darmstadt’s Simon Liebetegger, present a foundation for a holistic design and verification approach for power modules.

Renesas’ Marta Martínez Vázquez shows how to maintain high signal integrity and low losses throughout the entire RF signal path between MMIC and antenna.

Flex Logix’s Geoff Tate outlines the benefits from reducing cost and area while maintaining full reconfigurability and performance.

Infineon’s Filippo Rosetti digs into the advancements in battery management systems that will pave the way for safer, more efficient, and longer-lasting batteries.

Cadence’s Michael Jackson makes the case for AI to enhance design space exploration for complex PCB placement and routing.

Onto Innovation’s Keith Best zeroes in on next-gen IC substrates.

NI’s Kaitlyn Mazzarella looks at the role of power management integrated circuits (PMICs) in efficient power consumption.

Synopsys’ Rohan Bhatnagar explains how PVT monitors can help detect failures buried deep in chips.

Teradyne’s Fisher Zhang details why optimizing the design-manufacture-test loop can reduce defect escape rates and lower test costs.

Advantest’s Yoshiyuki Aoki  and Tsunetaka Akutagawa show how a micro-ammeter-frontend (MMAF) module can connect to the multifunction mixed high voltage (MMXHE) module to enable massively parallel, high-performance testing of power trains, controls, and sensors in electrified vehicles.

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