Blog Review: September 27

Algorithms and simulation performance; digital twins from chip to system; low-power verification; charging and EV adoption.


Siemens’ Dirk Hartmann examines how a continual improvement in predictive capability processing and algorithms enables the evolution of simulation performance and highlights two areas that underpin most simulation tools.

Synopsys’ Ian Land, Jason Niatas, and Marc Serughetti note that digital twins can be used from the chip level through sub-systems and up to the system level to examine performance issues, test-drive new features, and optimize different aspects of a product throughout the design and manufacturing processes.

Cadence’s Tyler Sherer argues that the strict power requirements of modern smartphones call for advanced low-power verification techniques that must be considered at the start of the development cycle.

Keysight’s Hwee Yng Yeo points to three things that are key to adoption of electric vehicles, from overcoming electrical grid power and charging station challenges to measuring battery cell self-discharge.

Codasip’s Zdeněk Přikryl checks out LLDB, a modular and extensible debugger that lives under the LLVM project and reuses a lot of code from an LLVM compiler, such as expression evaluation.

Arm’s Jiaming Guo continues demonstrating a performance analysis workflow on Armv8-A using Perf for Linux with the Performance Monitor Unit extension by showing how to select PMU events for analysis and collect statistics.

Ansys’ Laura Carter highlights two companies using simulation to develop driverless vehicle technologies from improved solid state lidar to an autonomous shuttle.

SEMI’s Margaret Kindling argues that male colleagues should be encouraged to attend women-focused events, such as Women in Semiconductors, to be part of the conversation about closing the gender gap and encouraging more equitable workplaces.

Plus, check out the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Amkor’s SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park, and JinYoung Kim investigate a laser-assisted bonding process where the laser emission from the bottom BGA side to bump is transmitted through the stage vacuum block.

eBeam Initiative’s Jan Willis makes the case that wire length reduction techniques such as curvy target shapes are needed to reduce congestion.

Brewer Science’s Jessica Albright presents methods for detecting and reducing defects in the fab and supply chain.

Advanced Energy’s Vitaly Petrishchev addresses the need for Angstrom Era precision and control with RF generator platforms.

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