Quantum Effects At 7/5nm And Beyond
By Ed Sperling - 23 May, 2018 - Comments: 5

Quantum effects are becoming more pronounced at the most advanced nodes, causing unusual and sometimes unexpected changes in how electronic devices and signals behave. Quantum effects typically occur well behind the curtain for most of the chip industry, baked into a set of design rules developed from foundry data that most companies never see. This explains why foundries and manufacturing e... » read more

Backchannel Modeling And Simulation Using Recent Enhancements To The IBIS Standard
By Cadence - 23 May, 2018 - Comments: 0

Recent enhancements to the upcoming IBIS standard now support backchannel training, enabling IBIS-AMI models to emulate this real-world SerDes behavior. AMI modelers now can incorporate backchannel algorithms into their IBIS-AMI models, automating the optimization of transmitter and receiver equalization settings in the same manner as their actual SerDes hardware devices. This saves system desi... » read more

Cure The Common Cold…
By Brian Fuller - 23 May, 2018 - Comments: 0

The technology sector has no equal in the ability of its people to visualize what might be possible and then make it happen fast. If we were sorting out the common cold, the sniffles may already have been relegated to the past. Maybe that’s a claim too far but while imagining the future has always been a feature of our world I think we’ve gone into overdrive in the last few years. From a... » read more

EDA In The Cloud (Part 3)
By Brian Bailey - 23 May, 2018 - Comments: 1

Semiconductor Engineering sat down to discuss the migration of EDA tools into the Cloud with Arvind Vel, director of product management at ANSYS; Michal Siwinski, vice president of product management at Cadence; Richard Paw, product marketing manager at DellEMC, Gordon Allan, product manager at Mentor, a Siemens Business; Doug Letcher, president and CEO of Metrics, Tom Anderson, technical marke... » read more

Blog Review: May 23
By Jesse Allen - 23 May, 2018 - Comments: 0

Cadence's Paul McLellan digs into the problems of test for 3D ICs s well as new approaches to cell-aware test, modular test and realistic IR drop at CDNLive EMEA. Mentor's Colin Walls shares four more embedded software tips, including always initializing a variable and when to use ++i instead of i++. Synopsys' Taylor Armerding points to a new way that phishing attacks could get around Mic... » read more

Manufacturing Bits: May 22
By Mark LaPedus - 22 May, 2018 - Comments: 0

Exotic water The Deutsches Elektronen-Synchrotron (DESY) organization, Uppsala University and SLAC have turned a large X-ray laser into the world’s fastest water heater. Using an X-ray free-electron laser from the SLAC National Accelerator Laboratory, researchers have heated water from room temperature to 100,000 degrees Celsius in less than a tenth of a picosecond or a millionth of a mil... » read more

System Bits: May 22
By Ann Mutschler - 22 May, 2018 - Comments: 0

AI disruptions and benefits in the workplace According to Stanford University researchers, artificial intelligence offers both promise and peril as it revolutionizes the workplace, the economy and personal lives. Visiting scholar James Timbie of the Hoover Institution, who studies artificial intelligence and other technologies, said that in the workplace of tomorrow, many routine jobs now p... » read more

Power/Performance Bits: May 22
By Jesse Allen - 22 May, 2018 - Comments: 0

Sensing without battery power Engineers at the National University of Singapore developed an IoT-focused sensor chip that can continue operating when its battery runs out of energy. The chip, BATLESS, uses a power management technique that allows it to self-start and continue to function under dim light without any battery assistance. The chip can operate in two different modes: minimum-ene... » read more

How To Build Functional Safety Into Your Design From The Start
By Antonio Priore - 21 May, 2018 - Comments: 0

The focus on functional safety IP is rapidly growing and we’re seeing this growth not just in automotive but in many other markets including, avionics, medical, industrial and railways, where systems need to efficiently identify and mitigate the occurrences of faults, and where more confidence is required with respect to the design practises employed for the development of IP. Currently, m... » read more

200mm Fab Crunch
By Mark LaPedus - 21 May, 2018 - Comments: 2

Growing demand for analog, MEMS and RF chips continues to cause acute shortages for both 200mm fab capacity and equipment, and it shows no sign of letting up. Today, 200mm fab capacity is tight with a similar situation projected for the second half of 2018 and perhaps well into 2019. In fact, 2018 will likely represent the third consecutive year that 200mm fab capacity will be tight. The sam... » read more

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