The Race To Mass Customization
By Ed Sperling - 09 Apr, 2018 - Comments: 0

The number of advanced packaging options continues to rise. The choices now include different materials for interposers, at least a half-dozen fan-outs, not to mention hybrid fan-out/3D stacking, system-in-package, flip-chip and die-to-die bridges. There are several reasons for all of this activity. First, advanced packaging offers big improvements in performance and power that cannot be ac... » read more

Choosing The Right Interconnect
By Ed Sperling - 09 Apr, 2018 - Comments: 3

Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

Xcerra’s Stock Buoyed by Busted Deal
By Jeff Dorsch - 09 Apr, 2018 - Comments: 0

The stock chart for XCRA, Xcerra’s common shares traded on the Nasdaq Global Select Market, looks like a hockey stick since late February, when the company called off its acquisition by Chinese investors in the face of opposition by the federal Committee on Foreign Investment in the United States. That busted deal may prove to be a blessing in disguise for Xcerra, which posts impressive finan... » read more

Integrated Software For CompactRIO
By NI - 09 Apr, 2018 - Comments: 0

Embedded software tools today are fragmented. This forces developers to waste time stitching together IDEs, compilers, debuggers, trace tools, profilers, and other disparate pieces in their toolboxes. Then they have to make these pieces cooperate with each other. Furthermore, these same developers must spend months building, testing, and debugging all the dependencies of an OS, middleware, a bo... » read more

Embedded Die Packaging Emerges
By Mark LaPedus - 09 Apr, 2018 - Comments: 1

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture in the arena, which is beginning to ramp up production. Additional... » read more

The Problem With Spin-On Carbon Materials
By Runhui Huang - 09 Apr, 2018 - Comments: 0

In an integrated circuit manufacturing process, spin-on-carbon (SOC) materials constitute an important layer for the multilayer process to achieve smaller feature size. The SOC layer responds to the photolithography, pattern transformation, substrate planarization, and a variety of other critical processes. A key challenge in selecting a suitable material is that some processes require a hig... » read more

Wireless Test Faces New Challenges
By Jeff Dorsch - 09 Apr, 2018 - Comments: 0

Your mobile phone is far more complex than it was even five years ago, and it’s about to become even more complex with new wireless technologies. That has set off a scramble among test equipment vendors to come up with solutions, methodologies and equipment that is affordable, effective and reliable enough to make sure all of this technology works as planned—and that it continues to work th... » read more

Functional Safety In AI-Controlled Vehicles
By Mentor, a Siemens Business - 09 Apr, 2018 - Comments: 0

Whereas ISO 26262 specifies requirements for eliminating safety hazards in the presence of an E/E system fault, this paper explains why new standards for the AI era must address so-called safety of the intended functionality (SOTIF), which means helping to validate that advanced automotive functionalities are engineered into the vehicle to avoid safety hazards even in the absence of a fault. ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Apr, 2018 - Comments: 0

Trade wars China and the United States are in the midst of a trade war. Click here for the latest from CNN. Meanwhile, click here for a list of the winners and losers so far. Display Supply Chain Consultants, a research firm, provides more insights from a hi-tech perspective. Gary Shapiro, president and CEO of the U.S.-based Consumer Technology Association (CTA), issued a statement abo... » read more

The Week In Review: Design
By Jesse Allen - 06 Apr, 2018 - Comments: 0

Tools Mentor, a Siemens business, filled in the last of the hardware configurations for its Veloce Strato emulation family, creating a full upgrade path. Users can initially purchase only the hardware that they need (StratoTiL) and if later they require more capacity (StratoTi) or the ability to handle larger designs (StratoT), they can incrementally add the necessary hardware to their existin... » read more

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