AI And Machine Learning Drive New SoC Verification Choices
By Frank Schirrmeister - 22 Feb, 2018 - Comments: 0

I have previously written about the choices that design teams have when choosing specific verification engines—virtual, formal, simulation, emulation, FPGA and actual silicon. As a new class of SoC is emerging for machine learning and artificial intelligence with complexities previously unheard of, they further deepen the challenge of choosing the right tool for the job. Even the choice betwe... » read more

ISO26262: The Case For Embedded Analytics In Automotive
By UltraSoC - 21 Feb, 2018 - Comments: 0

From advanced driver assistance systems (ADAS) to a new generation of robots and medical systems, we are seeing an explosion in the development of cyber-physical systems. Because these systems use advanced software to interact with the physical world, safety is a paramount issue but one that is reflected in many industries by the use of safety standards based on a philosophy of risk assessment ... » read more

A Complete Guide To Enclosure Thermal Design… 14 Key Considerations
By Mentor, a Siemens Business - 21 Feb, 2018 - Comments: 0

Enclosure design is an important aspect of system level thermal management to ensure electronics performance and reliability. Learn how to improve enclosure design in this guide covering 14 considerations on thermal management best practice. Examples of areas to focus on for advantages in cooling efficiency are illustrated and where tradeoff decisions are needed. Newly updated as of 2018, this... » read more

Functional Safety Methodologies For Automotive Applications
By Cadence - 21 Feb, 2018 - Comments: 0

Safety-critical automotive applications have stringent demands for functional safety and reliability. Traditionally, functional safety requirements have been managed by car manufacturers and system providers. However, with the increasing complexity of electronics involved, the responsibility of addressing functional safety is now propagating through the supply chain to semiconductor companies a... » read more

Partitioning Challenges In Multi-FPGA Prototyping
By Aldec - 21 Feb, 2018 - Comments: 0

Multi-FPGA prototyping of ASIC & SoC designs enables the highest clock rates among emulation techniques. However, design setup for prototyping is much more complicated and challenging. In this White Paper we uncover the common challenges of partitioning design to multiple FPGAs and provide solutions that will improve your prototype quality and shorten time spent on design setup. To read ... » read more

FD-SOI Adoption Expands
By Ed Sperling - 21 Feb, 2018 - Comments: 2

Fully depleted silicon-on-insulator (FD-SOI) is gaining ground across a number of new markets, ranging from IoT to automotive to machine learning, and diverging sharply from its original position as a less costly alternative to finFET-based designs. For years, [getkc id="220" kc_name="FD-SOI"] has been viewed as an either/or solution targeted at the same markets as bulk [gettech id="31093" c... » read more

Blog Review: Feb. 21
By Jesse Allen - 21 Feb, 2018 - Comments: 0

Mentor's Colin Walls posits that one part of the reason modern code has so many bugs may be the way we talk about them, and it's time for a change in terminology. Following up on a post about the challenges of bringing digital literacy to an area where many are unable to read, Cadence's Madhavi Rao looks at the impact agriculture-focused IoT technologies could have on rural areas in India. ... » read more

eSilicon Builds ASIC Business On Leading-Edge Chip Design
By eSilicon - 21 Feb, 2018 - Comments: 0

How advanced application specific integrated circuits (ASIC) chip design and manufacturing for leading-edge applications such as networking and artificial intelligence can be successfully outsourced. The company which has capabilities in 2.5D packaging, high-bandwidth memories (HBM), and silicon IP for fast memories and SerDes designs. The company has many leading system companies as custome... » read more

How To Build A Better MEMS Microphone
By Chris Welham - 21 Feb, 2018 - Comments: 0

We are seeing a lot of interest in simulating noise, particularly for condenser microphones. With any transducer, noise reduction is always a plus, and with microphones there are two specific applications that need low noise. One is where the microphone is positioned away from the sound source, such as in video calling or when using voice commands with tablet computers. The other is where multi... » read more

Manufacturing Bits: Feb. 20
By Mark LaPedus - 20 Feb, 2018 - Comments: 0

Hedgehog spin-vortex crystals The U.S. Department of Energy’s Ames Laboratory has discovered a missing piece to enable novel superconductor devices--the hedgehog spin-vortex crystal phase. Superconductors are devices that have zero electrical resistance, making them attractive for a range of applications. But superconductors must be cooled down to temperatures at or near absolute zero on ... » read more

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