Blog Review: Apr. 11
By Jesse Allen - 11 Apr, 2018 - Comments: 0

Mentor's Dennis Brophy looks at how the black box nature of IP means it's hard to tell if a block is free from security risks, even if verification IP and open-source design code can help. Synopsys' Sri Deepti Pisipati explains Panel Self Refresh, a power saving mechanism in Display Port that allows for turning off the video processor and its circuitry when an image is static. Cadence's P... » read more

Manufacturing Bits: April 10
By Mark LaPedus - 10 Apr, 2018 - Comments: 1

Higher power GaN Imec and Qromis have announced the development of a new gallium nitride (GaN) substrate technology that enables power devices at 650 volts and above. GaN is an emerging technology for power semiconductor applications. Based on a GaN-on-silicon technology, GaN-based power semis operate at 650 volts and above. In simple terms, the buffer layers between the GaN device and the ... » read more

System Bits: April 10
By Ann Mutschler - 10 Apr, 2018 - Comments: 0

Ultrafast laser beam steering for autonomous cars Researchers at Purdue University and Stanford University reported they have found a novel laser light sensing technology that is more robust and less expensive than currently available with a wide range of uses, including a way to guide fully autonomous vehicles. The team said this innovation is orders of magnitude faster than conventional l... » read more

Power/Performance Bits: Apr. 10
By Jesse Allen - 10 Apr, 2018 - Comments: 0

Lithium-air battery Researchers at the University of Illinois at Chicago and Argonne National Laboratory designed a new lithium-air battery that works in a natural air environment and still functioned after 750 charge/discharge cycles, a record for this battery type. In theory, lithium-air batteries work by combining lithium present in the anode with oxygen from the air to produce lithium p... » read more

The Race To Mass Customization
By Ed Sperling - 09 Apr, 2018 - Comments: 0

The number of advanced packaging options continues to rise. The choices now include different materials for interposers, at least a half-dozen fan-outs, not to mention hybrid fan-out/3D stacking, system-in-package, flip-chip and die-to-die bridges. There are several reasons for all of this activity. First, advanced packaging offers big improvements in performance and power that cannot be ac... » read more

Choosing The Right Interconnect
By Ed Sperling - 09 Apr, 2018 - Comments: 3

Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

Xcerra’s Stock Buoyed by Busted Deal
By Jeff Dorsch - 09 Apr, 2018 - Comments: 0

The stock chart for XCRA, Xcerra’s common shares traded on the Nasdaq Global Select Market, looks like a hockey stick since late February, when the company called off its acquisition by Chinese investors in the face of opposition by the federal Committee on Foreign Investment in the United States. That busted deal may prove to be a blessing in disguise for Xcerra, which posts impressive finan... » read more

Integrated Software For CompactRIO
By NI - 09 Apr, 2018 - Comments: 0

Embedded software tools today are fragmented. This forces developers to waste time stitching together IDEs, compilers, debuggers, trace tools, profilers, and other disparate pieces in their toolboxes. Then they have to make these pieces cooperate with each other. Furthermore, these same developers must spend months building, testing, and debugging all the dependencies of an OS, middleware, a bo... » read more

Embedded Die Packaging Emerges
By Mark LaPedus - 09 Apr, 2018 - Comments: 1

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture in the arena, which is beginning to ramp up production. Additional... » read more

The Problem With Spin-On Carbon Materials
By Runhui Huang - 09 Apr, 2018 - Comments: 0

In an integrated circuit manufacturing process, spin-on-carbon (SOC) materials constitute an important layer for the multilayer process to achieve smaller feature size. The SOC layer responds to the photolithography, pattern transformation, substrate planarization, and a variety of other critical processes. A key challenge in selecting a suitable material is that some processes require a hig... » read more

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