The Week In Review: Design/IoT
By Jesse Allen - 01 May, 2015 - Comments: 0

Tools Cadence released the new debug platform Indago, with the aim of reducing the time to identify bugs in a design by up to 50 percent compared to traditional signal- or transaction-level debug methods. Included are three debugging apps that provide an integrated debug solution for testbench, verification IP, and hardware/software debug for SoC designs. Mentor Graphics announced three n... » read more

FD-SOI Vs. FinFETs
By Ed Sperling - 30 Apr, 2015 - Comments: 0

Semiconductor Engineering sat down to compare the benefits, risks and challenges of moving to finFETs compared with fully depleted silicon on insulator ([getkc id="220" kc_name="FD-SOI"]) with Philippe Magarshack, group vice president for technology R&D at [getentity id="22331" comment="STMicroelectronics"]; Marco Brambilla, director of engineering at [getentity id="22150" e_name="Synapse D... » read more

One-On-One: Dark Possibilities
By Katherine Derbyshire - 29 Apr, 2015 - Comments: 0

Professor Michael Taylor’s research group at UC San Diego is studying ways to exploit dark silicon to optimize circuit designs for energy efficiency. He spoke with Semiconductor Engineering about the post-Dennard scaling regime, energy efficiency from integrated circuits all the way up to data centers, and how the manufacturing side can help. What follows are excerpts of that conversation. (P... » read more

Blog Review: April 29
By Jesse Allen - 29 Apr, 2015 - Comments: 0

Start your engines. At the Western US Freescale Cup, ARM's Sadanand Gulwadi had a front-row seat to the ingenuity displayed in autonomous model car racing. From turning an abandoned factory into the world's largest indoor farm to the millions invested in mining passing asteroids, Ansys' Bill Vandermark celebrates a week of Earth Day with his top five picks to read. "There is no Department... » read more

System Bits: April 28
By Ann Mutschler - 28 Apr, 2015 - Comments: 0

Transistor encasing for better device performance ECE Illinois researchers have discovered a more effective method for closing gaps in atomically small wires. Led by Professor Joseph W. Lyding and graduate student Jae Won Do, the team reported this new transistor technology comprised of carbon nanotube wires shows promise in replacing silicon because it can operate 10 times as fast and is ... » read more

Manufacturing Bits: April 28
By Mark LaPedus - 28 Apr, 2015 - Comments: 0

CIA and 3D printers Voxel8, a supplier of 3D printers, has closed a strategic investment and technology development agreement with In-Q-Tel (IQT), the venture capital arm of the U.S. Central Intelligence Agency (CIA). Voxel8, founded by technologists from Harvard University, is commercializing a new platform for 3D printing. The company enables engineers to create products with embedded 3D ... » read more

Power/Performance Bits: April 28
By Jesse Allen - 28 Apr, 2015 - Comments: 0

Printing graphene aerogels Lawrence Livermore National Laboratory researchers have made graphene aerogel microlattices with an engineered architecture via a 3D printing technique known as direct ink writing, potentially leading to better energy storage, sensors, and nanoelectronics. Aerogel is a synthetic porous, ultralight material derived from a gel, in which the liquid component of the... » read more

Analysis: Applied-TEL Scrap Merger
By Mark LaPedus - 27 Apr, 2015 - Comments: 0

After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. It appears that the U.S. Department of Justice (DoJ) stepped in and blocked the deal. Now that the deal has been terminated, Applied Materials and TEL are separately re-grouping, and are back to where they originally started as fierce compe... » read more

Industry Luminaries Outline China’s Semiconductor Growth Prospects
By Jonathan Davis - 27 Apr, 2015 - Comments: 1

Industry and government luminaries participating at the SEMICON China 2015 Grand Opening Keynote session, the Semiconductor Market & China Opportunity Forum, and the Tech Investment Forum reviewed the expanding business opportunities and the key domestic policies aimed at growing the semiconductor industry ecosystem in China. This article primarily covers insights on the government’s new ... » read more

Problems Ahead For EDA
By Brian Bailey - 27 Apr, 2015 - Comments: 0

You may have discovered that the Semiconductor Engineering Knowledge Center (KC) provides various ways in which data can be viewed. One way is to see what events happened in a given year. During the 1990s, company activity in terms of new startups and acquisitions reached a peak, and in 1997 there were at least 29 startups that the KC contains and 25 companies acquired (let us know if there wer... » read more

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