Power/Performance Bits: April 14
By Jesse Allen - 14 Apr, 2015 - Comments: 0

Elastic energy harvesting Researchers from the Korea Advanced Institute of Science and Technology (KAIST) and Seoul National University collaborated to develop a hyper-stretchable elastic-composite energy harvesting device. Their stretchable piezoelectric generator can harvest mechanical energy to produce a ~4V power output with around 250% elasticity and a durability over 104 cycles. The... » read more

TSMC Tech Tour De Force
By Barry Pangrle - 13 Apr, 2015 - Comments: 0

TSMC held the first of its three North American Tech Symposiums on April 7 in San Jose, with the other two coming up in Boston on April 14 and in Austin on April 16. As was mentioned previously here, the record fast ramp-time of the 20nm node was highlighted among other technological achievements. TSMC also released its March revenue report on April 10, and it shows a dramatic 49.8% increase in... » read more

EDA Sets New Record
By Ed Sperling - 13 Apr, 2015 - Comments: 0

EDA revenue grew 11.9% in Q4 2014 to $2.1 billion, a new record for the industry, propelled by strong growth in both IP and physical design. On a sequential basis, that represented a 15.1% increase, while on a year-over-year basis it was 11.9%. The four-quarter moving average, which takes into account quarterly aberrations, showed a 7.3% increase. "The semiconductor industry had a strong ... » read more

ChaoLogix: Integrated Security
By Ernest Worthman - 13 Apr, 2015 - Comments: 1

Semiconductor Engineering sat down with ChaoLogix’s chairman and CEO, Brian Kelly, and Chowdary Yanamadala, senior vice president of business development, to talk about the company's approach to securing semiconductors from side-channel attacks. SE: Given that the term “data security” has almost as many definition as there are braches, let start with a basic question: What does data s... » read more

Week 44: IoT impossible Without EDA
By Anne Cirkel - 10 Apr, 2015 - Comments: 1

Hype and timing aside, the IoT is likely to be the Internet’s next wave. Like all new waves, IoT probably won’t bear much resemblance to the descriptions of today’s prognosticators, though will lean heavily on earlier work and innovation – including by the EDA technologies that remain the core of DAC and our multibillion dollar industry, and the prime enabler of electronic design at lar... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Apr, 2015 - Comments: 1

Intel is quietly delaying its process ramp at the 10nm node, according to multiple sources. In an e-mail, a spokesman for Intel said: “We have not disclosed a schedule for our 10nm process and we won't engage in speculation about it.” In March, though, Intel was supposed to make fab tool buys for high-volume manufacturing at 10nm, sources said. But now, those purchases won’t happen... » read more

The Week In Review: Design/IoT
By Jesse Allen - 10 Apr, 2015 - Comments: 0

Certifications TSMC certified a number of tools for its current 10nm FinFET design rules and SPICE models and 16nm FinFET Plus (16FF+) V1.0 process, including: Ansys' power integrity and electromigration tools; Cadence's custom/analog and digital implementation and signoff tools; Mentor Graphics' physical verification, design for manufacturing, and circuit verification tools; and Synopsys' ful... » read more

Big Acquisitions, Big Changes
By Ed Sperling - 09 Apr, 2015 - Comments: 0

Rumors swirling about Intel's romance with Altera—this has been off-again, on-again, and now apparently off-again, for the better part of a decade—coupled with Apple's decision to shift A9 APU production to Samsung and away from TSMC, NXP's pending acquisition of Freescale, along with the Chinese' government's massive semiconductor investment fund, all add up to some massive shifts under wa... » read more

Stacked Die, Phase Two
By Ed Sperling - 09 Apr, 2015 - Comments: 0

The initial hype phase of [getkc id="82" kc_name="2.5D"] appears to be over. There are multiple offerings in development or on the market already from Xilinx, Altera, Cisco, Huawei, IBM, AMD, all focused on better throughput over shorter distances with better yield and lower power. Even Intel has jumped on the bandwagon, saying that 2.5D will be essential for extending [getkc id="74" comment="M... » read more

The Wild West Of Automotive
By Brian Bailey - 09 Apr, 2015 - Comments: 0

Automotive is considered one of the great new markets for EDA and IP. Electronic complexity is increasing rapidly, product update cycles are decreasing, and new standards mean that many of the old ways of doing development are no longer possible. Such change creates opportunity, along with a certain degreed of confusion. As the number of discrete systems increases, so do costs. Electronics c... » read more

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