Big Changes In Optical Inspection
By Ed Sperling - 16 Oct, 2024 - Comments: 0

Optical inspection always has been the workhorse technology for finding defects in chips. It's fast, cost-efficient, and generally reliable enough for most chips. But as logic scales into the angstrom range, and as systems become collections of chiplets, optical inspection needs to be combined with other types of inspection such as X-ray and acoustic. Kyle Vander Schaaf, application engineer at... » read more

Startup Funding: Q3 2024
By Jesse Allen - 16 Oct, 2024 - Comments: 0

Numerous new companies burst on the scene in the third quarter of 2024, including startups with plans for customizable RISC-V-based IP for applications from microcontrollers to data centers, high-speed data center interconnects, compute-in-memory LLM inference chips, and surveillance camera SoCs. Although it did not report funding, AheadComputing also launched last quarter to develop RISC-V cor... » read more

Shift Left The Design Process With Calibre Interactive Symmetry Checking
By Siemens EDA - 16 Oct, 2024 - Comments: 0

The traditional methods of symmetry checking are due for an update. The Calibre interactive, no code symmetry checking solution helps designers capture symmetry issues very early in the design cycle to reduce the number of iterations. Calibre interactive symmetry checking shifts left the whole verification process and reduces the time needed to reach tape out. What you’ll learn: Why the... » read more

Complete Migration Guide for Arm-Based Cloud Workloads
By Arm - 16 Oct, 2024 - Comments: 0

Learn in three steps how to migrate your self-managed workloads to Arm virtual machines for superior price performance and energy efficiency across a wide range of applications. This guide covers the most common scenarios and provides links to additional resources. You will learn how to: -Plan your transition, survey your software stack, and understand your software dependencies. -Test, ... » read more

Data Center Digital Twin Return On Investment From An Environmental Standpoint
By Cadence - 16 Oct, 2024 - Comments: 0

Data center operators face growing pressure to enhance sustainability. Understanding where inefficiencies occur is the first step toward making impactful changes. Cadence Reality DC Digital Twin helps you identify inefficiencies, implement solutions, and track improvements. This white paper reveals how Cadence Reality DC Digital Twin can save an average of 316MWh annually, delivering a retur... » read more

The Long Climb: Bringing Through Glass Vias (TGV) To High-Volume Manufacturing
By Keith Best - 15 Oct, 2024 - Comments: 0

The semiconductor industry is a land of peaks and valleys. It’s a place where each innovation represents the culmination of a long and often difficult climb to the summit. In the case of glass substrates, the peak of the mountain is in sight. The arrival of glass substrates comes at an opportune time, as the industry eyes new process innovations to meet the incredible demand for high perfo... » read more

Advancements In Silicon Device Technology And Design Driving New SLM Monitor Categories
By Ash Patel - 15 Oct, 2024 - Comments: 0

Silicon, the foundation of modern electronics, has seen continuous advancements since the early days of integrated circuits. The pace of innovation has been driven by the relentless quest for miniaturization, increased performance, and efficiency. However, Moore’s Law is no longer a given and silicon is facing functional limitations as technology scales. To address these challenges and conti... » read more

Metrology Advances Step Up To Sub-2nm Device Node Needs
By Laura Peters - 15 Oct, 2024 - Comments: 0

Metrology and inspection are dealing with a slew of issues tied to 3D measurements, buried defects, and higher sensitivity as device features continue to shrink to 2nm and below. This is made even more challenging due to increasing pressure to ramp new processes more quickly. Metrology tool suppliers must exceed current needs by a process node or two to ensure solutions are ready to meet tig... » read more

From Reaction To Prevention In Data Center RAS
By Noam Brousard - 15 Oct, 2024 - Comments: 0

The rise of artificial intelligence (AI), cloud services, and IoT has fueled the rapid expansion of hyperscale data centers. These massive facilities house thousands of servers, all working to support an increasingly digital world. But as the scale of data centers grows, so too does the need for reliable and high-performance semiconductors. Semiconductor failures and inconsistencies can cause s... » read more

Complex Heterogeneous Integration Drives Innovation In Semiconductor Test
By Jeorge Hurtarte - 15 Oct, 2024 - Comments: 0

Heterogeneous integration is driving innovation in the semiconductor industry, but it also introduces more complexity in chip design, which translates to more intricate test requirements. The automated test equipment (ATE) industry is responding, developing and utilizing more sophisticated test equipment capable of handling the diverse functionalities and interfaces needed to test heterogeneous... » read more

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