Chip Industry’s Technical Paper Roundup: October 9
By Liz Allan - 09 Oct, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=153 /] More Reading Technical Paper Library home » read more

Characterization, Modeling, And Model Parameter Extraction Of 5nm FinFETs
By Technical Paper Link - 06 Oct, 2023 - Comments: 0

A technical paper titled “A Comprehensive RF Characterization and Modeling Methodology for the 5nm Technology Node FinFETs” was published by researchers at IIT Kanpur, MaxLinear Inc., and University of California Berkeley. Abstract: "This paper aims to provide insights into the thermal, analog, and RF attributes, as well as a novel modeling methodology, for the FinFET at the industry stan... » read more

Novel NVM Devices and Applications (UC Berkeley)
By Technical Paper Link - 06 Oct, 2023 - Comments: 0

A dissertation titled “Novel Non-Volatile Memory Devices and Applications” was submitted by a researcher at University of California Berkeley. Abstract Excerpt "This dissertation focuses on novel non-volatile memory devices and their applications. First, logic MEM switches are demonstrated to be operable as NV memory devices using controlled welding and unwelding of the contacting electro... » read more

Estimating the Embedded Gate Resistance to Reproduce SiC MOSFET Circuit Performance (ROHM)
By Technical Paper Link - 06 Oct, 2023 - Comments: 0

A technical paper titled “Improved Scheme for Estimating the Embedded Gate Resistance to Reproduce SiC MOSFET Circuit Performance” was published by researchers at ROHM Company. Abstract: "The intrinsic gate resistance ( Rg_in) , which is a novel resistance factor embedded in transistors, was determined for silicon carbide (SiC) metal–oxide–semiconductor field-effect transistors (MOSFE... » read more

Chip Industry Week In Review
By The SE Staff - 06 Oct, 2023 - Comments: 0

By Jesse Allen, Liz Allan, and Gregory Haley A potential government shutdown beginning in November would be "massively disruptive" for the Commerce Department as it continues to disburse critical funding featured in the CHIPS Act to boost semiconductor research and development in the U.S., according to Secretary Gina Raimondo. Global semiconductor industry sales totaled $44 billion in Aug... » read more

Simplifying Power Module Verification Using Compliance Checking
By Wilfried Wessel - 05 Oct, 2023 - Comments: 0

By Wilfried Wessel, Siemens EDA; Simon Liebetegger, University of Applied Sciences, Darmstadt; and Florian Bauer, Siemens EDA Current simulation and verification methods for power modules are time-consuming. Each domain has specific solutions based on finite elements analysis, computational fluid dynamics and solvers for electric circuits like SPICE. This article investigates if it is possib... » read more

Securing Automotive Ethernet Connections With MACsec
By Maxim Demchenko - 05 Oct, 2023 - Comments: 0

Zonal architecture in automotive design has become common in recent years in response to the increasing complexity of in-vehicle electrical systems. Automotive Ethernet is used to connect sensors and actuators to zonal gateways in ADAS (Advanced Driver Assistance Systems) enabled vehicles. With multi-gigabit links, it further connects zonal gateways to the central compute units that handle ADAS... » read more

How Much AI Is Really Needed?
By John Koon - 05 Oct, 2023 - Comments: 0

Tensor Core GPUs have created a generative AI model gold rush. Whether it’s helping students with math homework, planning a vacation, or learning to prepare a six-course meal, generative AI is ready with answers. But that's only one aspect of AI, and not every application requires it. AI — now an all-inclusive term, referring to the process of using algorithms to learn, predict, and make... » read more

The Ultimate Guide To PCB Layout For GaN Transistors
By Francesco Di Domenico - 05 Oct, 2023 - Comments: 0

In the ever-evolving landscape of power electronics, the emergence of gallium nitride (GaN) transistors has ignited a revolution by offering unparalleled benefits, including remarkable efficiency and power density enhancements. The art of PCB layout has been a crucial component in power electronic design for over four decades now, ever since the advent of switching power supplier. From the ea... » read more

Making Sensors More Reliable
By Karen Heyman - 05 Oct, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the latest issues in sensors with Prakash Madhvapathy, director of product marketing, Tensilica audio/voice DSPs group at Cadence; Kevin Hughes, senior product manager for MEMS sensors at Infineon; and Matthew Hogan, product management director at Siemens EDA. What follows are excerpts of that conversation. [L-R] Kevin ... » read more

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