Power-Aware Test Vector Porting For Production ATE
By Hari Mani - 12 Nov, 2024 - Comments: 0

Power management in contemporary system-on-chip (SoC) designs is almost unimaginably complex. Processors and other chip cores turn on and off as needed. Advanced features such as dynamic voltage and frequency scaling (DVFS) can adjust to changing conditions and incrementally adjust power and performance on the fly. Power management starts from the lowest hardware level of transistor structures ... » read more

AI’s Ability To Deliver Breakthroughs Across Semiconductor Design And Manufacturing
By John Kibarian - 12 Nov, 2024 - Comments: 0

AI holds great promise for our industry. It will help close the divide between design, manufacturing and test that is required to effectively produce today’s most advanced hybrid devices. One way to look at the potential impact of AI in the semiconductor industry is to realize that it is more and more driven by software engineering. When designing a chip, it’s essentially like writing... » read more

Advanced Packaging Drives Test And Metrology Innovations
By Gregory Haley - 12 Nov, 2024 - Comments: 0

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with those changes. In the past, major developments were roughly on an 18-month to 2-year cadence. Today, this is happening every few mon... » read more

Yield Management Embraces Expanding Role
By Laura Peters - 12 Nov, 2024 - Comments: 0

Competitive pressures, shrinking time-to-market windows, and increased customization are collectively changing the dynamics and demands for yield management systems, shifting left from the fab to the design flow and right to assembly, packaging, and in-field analysis. The basic role of yield management systems is still expediting new product introductions, reducing scrap, and delivering grea... » read more

Balancing Parallel Test Productivity With Yield & Cost
By Anne Meixner - 12 Nov, 2024 - Comments: 0

Parallel test is used for nearly every device produced by fabs and OSATs, but it can reduce yield and increase the cost of test boards and operations. This is a well-understood tradeoff for ensuring consistent test accuracy across multiple sites and reducing test time. Collectively, ATEs and multi-site test boards — DUT interface boards (DIBs), probe cards, and load boards — significantl... » read more

FTIR Detects Counterfeit Electronics
By Inga Koehler - 12 Nov, 2024 - Comments: 0

FTIR spectroscopy detects counterfeit electronics fast and effectively.[1] It provides a critical solution in the fight against counterfeit products that threaten various sectors of our economy. As counterfeits infiltrate industries like fashion, pharmaceuticals, and luxury goods, they pose serious risks. With the advancement of technology, counterfeit components in electronics are becom... » read more

Silicon Carbide And Gallium Nitride Bring New Challenges For Semiconductor Test
By Jeorge Hurtarte - 12 Nov, 2024 - Comments: 0

In the era of megatrends such as electric vehicles (EVs), new technologies are emerging to keep up with evolving demands. One example of this is the evolution of compound semiconductors that use silicon carbide (SiC) and gallium nitride (GaN) for high-performance power systems. Innovating test protocols to handle wide bandgap materials For many power-related applications, the semiconductor in... » read more

A Renaissance Of Innovation
By Keith Schaub - 12 Nov, 2024 - Comments: 0

Innovation in semiconductor testing plays a critical role in the advancement of the semiconductor industry, ensuring that the chips and components that power modern technology are reliable, efficient, and capable of meeting the ever-increasing demands of various applications. As semiconductors become more complex, the methods and technologies used to test them must also evolve to maintain quali... » read more

Outsmarting Silent Data Corruption In AI Processors With Two-Stage Detection
By proteanTecs - 12 Nov, 2024 - Comments: 0

Silent data corruption is on the rise following advancements in semiconductor technology. The explosion in AI for speech, image, video, and text processing leads to a growing complexity and diversity of hardware systems, bringing an increased risk to data integrity. SDC rate is much higher than software engineers expect, undermining the hardware reliability they used to take for granted. Rec... » read more

High-Temperature Processing of Molybdenum Interconnects
By Technical Paper Link - 11 Nov, 2024 - Comments: 0

A technical paper titled "Solving the Annealing of Mo Interconnects for Next-Gen Integrated Circuits" was published by researchers at the National University of Singapore, A*STAR, and imec. Abstract "Recent surge in demand for computational power combined with strict constraints on energy consumption requires persistent increase in the density of transistors and memory cells in integrated ... » read more

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