True 3D-IC Problems
By Brian Bailey - 27 Apr, 2023 - Comments: 0

Placing logic on logic may sound like a small step, but several problems must be overcome to make it a reality. True 3D involves wafers stacked on top of each other in a highly integrated manner. This is very different from 2.5D integration, where logic is placed side-by-side, connected by an interposer. And there are some intermediate solutions today where significant memory is stacked on l... » read more

Can Compute-In-Memory Bring New Benefits To Artificial Intelligence Inference?
By Paul Karazuba - 27 Apr, 2023 - Comments: 0

Compute-in-memory (CIM) is not necessarily an Artificial Intelligence (AI) solution; rather, it is a memory management solution. CIM could bring advantages to AI processing by speeding up the multiplication operation at the heart of AI model execution. However, for that to be successful, an AI processing system would need to be explicitly architected to use CIM. The change would entail a shift ... » read more

What’s Next In Wireless Standard Adoption?
By Chen Chang - 27 Apr, 2023 - Comments: 0

By Chen Chang and Alejandro Escobar Calderon Although each generation in wireless technologies often introduces enhanced capabilities, the broad adoption of any new technology requires both technical and business viability. For 5G, solving for technical challenges such as path loss and radio front-end efficiency has led to massive innovations in network design, semiconductor packaging, and t... » read more

Designing For In-Circuit Monitors
By Ann Mutschler - 27 Apr, 2023 - Comments: 0

In every application space the semiconductor ecosystem touches, in-circuit monitors and sensors are playing an increasing role in silicon lifecycle management and concepts around reliability and resiliency — both during design as well as in the field. The combination of true system-level design, in/on-chip monitors, and improved data analysis are expected to drastically improve reliability... » read more

The Drive To Disrupt: How Digital Twins Are Fueling Automotive Innovation
By Jenn Mullen - 27 Apr, 2023 - Comments: 0

It can be argued that disruptive innovation in the auto sector has defined each of the modern eras. Through history, engineering breakthroughs have shaped the human experience. The wheel and calendar, printing press and cotton gin, electricity and the assembly lines are the vehicles by which we tell the story of human progress. Henry Ford's assembly line not only democratized motor vehicle owne... » read more

Working With The NimbleAI Project To Push The Boundaries Of Neuromorphic Vision
By Tora Fridholm - 27 Apr, 2023 - Comments: 0

At the end of 2022, the EU kicked off a cool project that aims to implement neuromorphic vision. But what is that? Let’s take a deeper look at the project and our contribution. First, if you are not familiar with Codasip Labs, I want to mention this briefly. Codasip Labs is in fact our innovation hub where we explore new technologies and try to contribute to the technology of the future. ... » read more

Easy-To-Use Reliability Checks Throughout The Design Cycle From IP To Full-Chip Tapeout
By Hossam Sarhan - 27 Apr, 2023 - Comments: 0

By Hossam Sarhan and Alexandre Arriordaz With the increasing complexity of design layouts and shorter tapeout cycles, waiting until signoff verification is no longer practical for design teams. There is a constant push to shift targeted verification activities “left” to earlier stages in the design flow. Finding and eliminating selected errors earlier during design and implementation, wh... » read more

Improved DSP And AI Performance On An MCU Core
By Eldar Sido - 27 Apr, 2023 - Comments: 0

In the world of embedded devices, there's a growing demand for advanced machine learning and signal processing capabilities. ARM Cortex-M85, the latest general-purpose core, aims to meet these demands with its 32-bit Armv8.1-M architecture, offering high performance and power efficiency. The core's Helium technology, M-profile vector extension (MVE), provides significant uplift for ML/DSP appl... » read more

Notes From CadenceLIVE Silicon Valley 2023
By Paul McLellan - 27 Apr, 2023 - Comments: 0

Last week was CadenceLIVE Silicon Valley, held at the Santa Clara Convention Center, and took place, as usual, over two days. It was very well attended and everywhere seemed fairly crowded. The structure of CadenceLIVE was that the first morning was taken up with four keynotes. Then the rest of the day and all of the following day were taken up with about ten parallel technical tracks. And at l... » read more

Hardware-Accelerated RTL Simulator
By Technical Paper Link - 26 Apr, 2023 - Comments: 0

A technical paper titled "Manticore: Hardware-Accelerated RTL Simulation with Static Bulk-Synchronous Parallelism" was published by researchers at EPFL, University of Tokyo, Sharif University, and Indian Institute of Technology. Abstract "The demise of Moore's Law and Dennard Scaling has revived interest in specialized computer architectures and accelerators. Verification and testing of thi... » read more

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