Room-Temperature Metal Bonding Technology That Facilitates The Fabrication of 3D-ICs & 3D Integration With Heterogeneous Devices


A technical paper titled "Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration With μLED" was published by researchers at Tohoku University in Japan. Abstract: "This letter describes a direct Cu bonding technology to there-dimensionally integrate heterogeneous dielets based on a chip-on-wafer configuration. 100- μm -cubed blue μ LED... » read more

Solving The Reliability Problem Of Memristor-Based Artificial Neural Networks


A technical paper titled "ReMeCo: Reliable Memristor-Based in-Memory Neuromorphic Computation" was published by researchers at Eindhoven University of Technology, University of Tehran, and USC. Abstract: "Memristor-based in-memory neuromorphic computing systems promise a highly efficient implementation of vector-matrix multiplications, commonly used in artificial neural networks (ANNs). H... » read more

Shift Register-In-Memory Architecture


A new technical paper titled "Toward Single-Cell Multiple-Strategy Processing Shift Register Powered by Phase-Change Memory Materials" was published by researchers at Singapore University of Technology and Design and University of Cambridge. Abstract "Modern innovations are built on the foundation of computers. Compared to von Neumann architectures having separate storage and processing uni... » read more

Reducing The Cost of Cache Coherence By Integrating HW Coherence Protocol Directly With The Programming Language


A new technical paper titled "WARDen: Specializing Cache Coherence for High-Level Parallel Languages" was published by researchers at Northwestern University and Carnegie Mellon University. Abstract: "High-level parallel languages (HLPLs) make it easier to write correct parallel programs. Disciplined memory usage in these languages enables new optimizations for hardware bottlenecks, such ... » read more

Large-Scale Nanometer-Thick Graphite Film (NGF) As A EUV Pellicle


A new technical paper titled "Graphite Pellicle: Physical Shield for Next-Generation EUV Lithography Technology" was published by researchers at University of Ottawa, Sungkyunkwan University, and Hanbat National University. Abstract "Extreme ultraviolet lithography (EUVL) is widely employed in the electronics, automotive, military, and AI computing areas for IC chip fabrication. A pellicl... » read more

Evaluation of the Thermomechanical Reliability of Electronic Packages Using Virtual Prototyping


A new technical paper titled "Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies" was published by Fraunhofer ENAS. Abstract "A methodology is presented that allows the evaluation of the thermomechanical reliability of electronic packages using “virtual prototyping.” He... » read more

Startup Funding in China 2022: Sortable Funding Chart


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Week In Review: Semiconductor Manufacturing, Test


Samsung announced plans to invest $230 billion (300 trillion won) over the next two decades to construct the world’s largest semiconductor manufacturing complex in South Korea’s Gyeonggi Province, reports AP. The complex will consist of five new semiconductor plants producing memory and logic chips. Chips will be the enabling engines, requiring massive investments in new technology, m... » read more

Week In Review: Auto, Security, Pervasive Computing


North Americas’s first zero-emission hydrogen-powered “Train de Charlevoix” will start running in Canada this summer, with speeds up to 85 mph, only emitting water vapor. Germany rolled out the world’s first passenger train fleet in 2022. The U.S. Department of Energy announced the availability of $750 million for R&D to further clean hydrogen technologies, part of the Biparti... » read more

Week In Review: Design, Low Power


The UK government published its National Quantum Strategy, which outlines the plan to invest £2.5 billion (~$3.0 billion) over the next 10 years into quantum technology, including computing, sensing, timing, imaging, and networking. "We will develop UK strengths across different hardware platforms, software, and components, and reinforce our capabilities throughout the supply chains. Although ... » read more

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