High SNR Microphones Are Transforming Laptops Into All-Round Communication Hubs
By Infineon - 01 Mar, 2023 - Comments: 0

Large portions of the workforce continue to work from home or in hybrid models. Although some organizations are largely getting back to ‘normal’, many people have grown accustomed to meeting online. Without face-to-face meetings in the office, productive and efficient communication relies on good tools, from video conferencing software to computer hardware. Two decades ag... » read more

U.S. Opens Funding Applications Under CHIPS Act
By Linda Christensen - 28 Feb, 2023 - Comments: 0

The 2022 Chips and Science Act provided $39 billion in federal funding to revitalize the U.S. semiconductor industry. Now, the U.S. Department of Commerce, the oversight branch for the CHIPS Act, has taken the first step in opening up applications for this funding. This initial funding opportunity focuses on applications specifically for projects to “construct, expand, or modernize commerc... » read more

Research Bits: Feb. 28
By SE Staff - 28 Feb, 2023 - Comments: 0

Single-molecule switch An international team of researchers have demonstrated a switch on a single fullerene molecule. Using a laser, the team switched the path of an incoming electron. “What we’ve managed to do here is control the way a molecule directs the path of an incoming electron using a very short pulse of red laser light,” said Project Researcher Hirofumi Yanagisawa from the Uni... » read more

Chip Industry’s Technical Paper Roundup: Feb. 28
By Linda Christensen - 28 Feb, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=83 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Chiplet Placer with Thermal Consideration for 2.5D ICs
By Technical Paper Link - 27 Feb, 2023 - Comments: 0

A new technical paper titled "Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration" was published by researchers at National Yang Ming Chiao Tung University (Taiwan). Abstract "This work develops an efficient chiplet placer with thermal consideration for 2.5D ICs. Combining the sequence-pair based tree, branch-and-bound method, and advanced placement/pruning... » read more

Review of Methods to Design Secure Memristor Computing Systems
By Technical Paper Link - 27 Feb, 2023 - Comments: 0

A technical paper titled "Review of security techniques for memristor computing systems" was published by researchers at Israel Institute of Technology, Friedrich Schiller University Jena (Germany), and Leibniz Institute of Photonic Technology (IPHT). Abstract "Neural network (NN) algorithms have become the dominant tool in visual object recognition, natural language processing, and robotic... » read more

Fast Time-Resolved Scanning Tunneling Microscopy (STM) for Nanostructures
By Technical Paper Link - 27 Feb, 2023 - Comments: 0

A new technical paper titled "Externally-triggerable optical pump-probe scanning tunneling microscopy with a time resolution of tens-picosecond" was published by researchers at University of Tsukuba and UNISOKU Co. According to the U. of Tsukaba news article, "OPP STM is an essential method for measuring photo-induced charge carrier dynamics in nanostructures, but requires technical advances... » read more

How To Build Resilience Into Chips
By Ed Sperling and Ann Mutschler - 27 Feb, 2023 - Comments: 0

Disaggregating chips into specialized processors, memories, and architectures is becoming necessary for continued improvements in performance and power, but it's also contributing to unusual and often unpredictable errors in hardware that are extremely difficult to find. The sources of those errors can include anything from timing errors in a particular sequence, to gaps in bonds between chi... » read more

Security-Aware Compiler-Assisted Countermeasure to Mitigate Fault Attacks on RISC-V
By Technical Paper Link - 26 Feb, 2023 - Comments: 0

A new technical paper titled "CompaSeC: A Compiler-Assisted Security Countermeasure to Address Instruction Skip Fault Attacks on RISC-V" was published by researchers at TU Munich and Fraunhofer Institute for Applied and Integrated Security (AISEC). Abstract "Fault-injection attacks are a risk for any computing system executing security-relevant tasks, such as a secure boot process. While ha... » read more

Index-Based Multi-Core BDD Package With Dynamic Memory Management & Reduced Fragmentation
By Technical Paper Link - 26 Feb, 2023 - Comments: 0

A technical paper titled "EDDY: A Multi-Core BDD Package with Dynamic Memory Management and Reduced Fragmentation" was published by researchers at University of Bremen. ABSTRACT "In recent years, hardware systems have significantly grown in complexity. Due to the increasing complexity, there is a need to continuously improve the quality of the hardware design process. This leads designers t... » read more

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