Research Bits: Feb. 19


DNA assembly of 3D nanomaterials Scientists from Brookhaven National Laboratory, Columbia University, and Stony Brook University developed a method that uses DNA to instruct molecules to organize themselves into targeted 3D patterns and produce a wide variety of designed metallic and semiconductor 3D nanostructures. “We have been using DNA to program nanoscale materials for more than a de... » read more

Chip Industry Technical Paper Roundup: Feb. 19


New technical papers added to Semiconductor Engineering’s library this week. [table id=199 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


By Susan Rambo, Karen Heyman, and Liz Allan. Renesas plans to acquire Altium, maker of PCB design software, for $5.9 billion. In a conference call, Renesas CEO Hidetoshi Shibata cited Altium's PCB design software and digital twin virtual modeling as key components of its future strategy. "I believe it will generate transformational value for our combined customers and our stakeholders," Shib... » read more

FPGA-Based HW/SW Platform For Pre-Silicon Emulation Of RISC-V Designs (Barcelona Supercomputing Center)


A technical paper titled “Makinote: An FPGA-Based HW/SW Platform for Pre-Silicon Emulation of RISC-V Designs” was published by researchers at Barcelona Supercomputing Center and Universitat Politècnica de Catalunya. Abstract: "Emulating chip functionality before silicon production is crucial, especially with the increasing prevalence of RISC-V-based designs. FPGAs are promising candidate... » read more

HW Security Bug Characteristics in Google’s OpenTitan Silicon Root Of Trust Project 


A technical paper titled “An Investigation of Hardware Security Bug Characteristics in Open-Source Projects” was published by researchers at NYU Tandon School of Engineering and University of Calgary. Abstract: "Hardware security is an important concern of system security as vulnerabilities can arise from design errors introduced throughout the development lifecycle. Recent works have pro... » read more

Directly Writing and Rewriting Photonic Chips on Low-Loss Phase-Change Thin Films


A technical paper titled “Freeform direct-write and rewritable photonic integrated circuits in phase-change thin films” was published by researchers at University of Washington, University of Maryland, and Tianjin University. Abstract: "Photonic integrated circuits (PICs) with rapid prototyping and reprogramming capabilities promise revolutionary impacts on a plethora of photonic technolo... » read more

New Metasurface Architecture To Deliver Ultrafast Information Processing And Versatile Terahertz Sources


A technical paper titled “Light-driven nanoscale vectorial currents” was published by researchers at Los Alamos National Laboratory, Menlo Systems, University of California Davis, Columbia University, Sandia National Laboratories, and Intellectual Ventures. Abstract: "Controlled charge flows are fundamental to many areas of science and technology, serving as carriers of energy and informa... » read more

Building Scalable And Efficient Data Centers With CXL


The AI boom is giving rise to profound changes in the data center; demanding AI workloads are driving an unprecedented need for low latency, high-bandwidth connectivity and flexible access to more memory and compute power when needed. The Compute Express Link (CXL) interconnect offers new ways for data centers to enhance performance and efficiency between CPUs, accelerators and storage and move... » read more

Photonics: Harnessing The Power of Light


All around us, light is at work. The cameras on our phones, the parking sensors in our cars, the monitors on our desks — all are using the power of light to improve our daily lives thanks to a field of study called “photonics.” What is photonics? Photonics is a multidisciplinary domain that involves the generation, control, manipulation, and detection of light. Light, a form of elect... » read more

The Seven Pillars Of IC Package Physical Design


Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what can be currently achieved in traditional monolithic SoC designs. Figure 1. A heterogeneously integrated device with 47 chiplets. (Image Source: Intel) The evolving landscape of packagin... » read more

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