Computational Lithography Solutions To Enable High NA EUV
By Synopsys - 21 Feb, 2024 - Comments: 0

This white paper identifies and discusses the computational needs required to support the development, optimization, and implementation of high NA extreme ultraviolet (EUV) lithography. It explores the challenges associated with the increased complexity of high NA systems, proposes potential solutions, and highlights the importance of computational lithography in driving the success of advanced... » read more

Broad Impact From Accelerating Tech Cycles
By Ed Sperling - 21 Feb, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of leading edge technologies such as generative AI in data centers, AR/VR, and security architectures for connected devices, with Michael Kurniawan, business strategy manager at Accenture; Kaushal Vora, senior director and head of business acceleration and ecosystem at Renesas Electronics; Paul Karazuba, vice preside... » read more

Blog Review: Feb. 21
By Jesse Allen - 21 Feb, 2024 - Comments: 0

Siemens' John McMillan digs into physical verification maturity for high-density advanced packaging (HDAP) designs and major differences in the LVS verification flow compared to the well-established process for SoCs. Synopsys' Varun Shah identifies why a cloud adoption framework is key to getting the most out of deploying EDA tools in the cloud, including by ensuring that different types of ... » read more

White-Box Fuzzer With Static Analysis To Detect And Locate Timing Vulnerabilities In RISC-V Processors 
By Technical Paper Link - 20 Feb, 2024 - Comments: 0

A technical paper titled “WhisperFuzz: White-Box Fuzzing for Detecting and Locating Timing Vulnerabilities in Processors” was published by researchers at Indian Institute of Technology Madras, Texas A&M University, and Technische Universität Darmstadt. Abstract: "Timing vulnerabilities in processors have emerged as a potent threat. As processors are the foundation of any computing s... » read more

Impact of Scaling and BEOL Technology Solutions At The 7nm Node On MRAM
By Technical Paper Link - 20 Feb, 2024 - Comments: 0

A technical paper titled “Impact of Technology Scaling and Back-End-of-the-Line Technology Solutions on Magnetic Random-Access Memories” was published by researchers at Georgia Institute of Technology. Abstract: "While magnetic random-access memories (MRAMs) are promising because of their nonvolatility, relatively fast speeds, and high endurance, there are major challenges in adopting the... » read more

Rapid Exchange Cooling With Trapped Ions For Implementation In A Quantum Charge-Coupled Device
By Technical Paper Link - 20 Feb, 2024 - Comments: 0

A technical paper titled “Rapid exchange cooling with trapped ions” was published by researchers at Georgia Tech Research Institute. Abstract: "The trapped-ion quantum charge-coupled device (QCCD) architecture is a leading candidate for advanced quantum information processing. In current QCCD implementations, imperfect ion transport and anomalous heating can excite ion motio... » read more

Ultra-Low Power CiM Design For Practical Edge Scenarios
By Technical Paper Link - 20 Feb, 2024 - Comments: 0

A technical paper titled “Low Power and Temperature-Resilient Compute-In-Memory Based on Subthreshold-FeFET” was published by researchers at Zhejiang University, University of Notre Dame, Technical University of Munich, Munich Institute of Robotics and Machine Intelligence, and the Laboratory of Collaborative Sensing and Autonomous Unmanned Systems of Zhejiang Province. Abstract: "Compute... » read more

Electronic Noise in vdW Layered AFMS (UCLA)
By Technical Paper Link - 20 Feb, 2024 - Comments: 0

A technical paper titled “Electronic Noise Spectroscopy of Quasi-2D van der Waals Antiferromagnetic Semiconductors” was published by researchers at University of California Los Angeles. Abstract: "We investigated low-frequency current fluctuations, i.e. electronic noise, in FePS3 van der Waals, layered antiferromagnetic semiconductor. The noise measurements have been used as noise spectro... » read more

Why Chiplets Are So Critical In Automotive
By John Koon - 20 Feb, 2024 - Comments: 1

Chiplets are gaining renewed attention in the automotive market, where increasing electrification and intense competition are forcing companies to accelerate their design and production schedules. Electrification has lit a fire under some of the biggest and best-known carmakers, which are struggling to remain competitive in the face of very short market windows and constantly changing requir... » read more

Latency, Interconnects, And Poker
By Ed Sperling - 20 Feb, 2024 - Comments: 0

Semiconductor Engineering sat down with Larry Pileggi, Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering at Carnegie Mellon University, and the winner of this year's Phil Kaufman Award for Pioneering Contributions. What follows are excerpts of that conversation. SE: When did you first get started working in semiconductors — and particularly, EDA? Pileggi: This w... » read more

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