How Simulation Addresses Hydrogen Fuel Challenges
By Kiyoung Jung - 18 Jul, 2024 - Comments: 0

By Kiyoung Jung and Kyutae Kim Hydrogen has gained the front seat as a fuel for carbon neutrality. The absence of carbon emission at the point of utilization makes it attractive for net-zero initiatives. Hydrogen fuel possesses qualities like higher flame speed (8x higher), lower ignition energy requirements (15x lower), and wider flammability limit (4% to 70%) compared to typical hydrocar... » read more

SiC Power Electronics Packaging: Floating Die Structure and Liquid Metal Fluidic Connection (Cambridge U. )
By Technical Paper Link - 17 Jul, 2024 - Comments: 0

A new technical paper titled "Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging" was published by researchers at Cambridge University. Abstract "Coefficients of thermal expansion (CTE) of various materials in packaging structure layers vary largely, causing significant thermomechanical stress in power electroni... » read more

HW Security: Flip-Flops Along Logic Gates to Prevent Synthesis Tools’ Structural Leakages (TU Dresden, Ruhr Univ. Bochum)
By Technical Paper Link - 17 Jul, 2024 - Comments: 0

A new technical paper titled "Flip-Lock: A Flip-Flop-Based Logic Locking Technique for Thwarting ML-based and Algorithmic Structural Attacks" was published by researchers at TU Dresden and Ruhr University Bochum. Abstract "Machine learning (ML) and algorithmic structural attacks have highlighted the possibility of utilizing structural leakages of an obfuscated circuit to reverse engineer th... » read more

Functional Compaction for Functional Test Sequences (Purdue University, I. Pomeranz)
By Technical Paper Link - 17 Jul, 2024 - Comments: 0

A new technical paper titled "Functional Compaction for Functional Test Sequences" was published by IEEE Fellow Irith Pomeranz at Purdue University. Abstract: "The occurrence of silent data corruption because of hardware defects in large scale data centers points to the advantages of applying functional test sequences to detect hardware defects that escape scan-based tests. When using funct... » read more

Excitonic Phenomena in TMDs (Harvard, Google, Stanford et al.)
By Technical Paper Link - 17 Jul, 2024 - Comments: 0

A new technical paper titled "Dynamical Control of Excitons in Atomically Thin Semiconductors" was published by researchers at Harvard University, Google Research, Stanford University, UC Riverside and others. Abstract "Excitons in transition metal dichalcogenides (TMDs) have emerged as a promising platform for novel applications ranging from optoelectronic devices to quantum optics and sol... » read more

Rigid-Flex PCB Design Guidelines
By Siemens EDA - 17 Jul, 2024 - Comments: 0

This white paper is designed to guide you through the intricacies of rigid-flex printed circuit board (PCB) design. In today's electronics industry, there has never been more demand for compact, efficient, and versatile PCBs. Rigid-flex technology has emerged as a game-changer, offering engineers the flexibility to design boards that can bend and flex without sacrificing performance or reliabil... » read more

Evolving Edge Computing
By Arm - 17 Jul, 2024 - Comments: 0

Edge computing is a term that has been in use for a long time. Throughout the industry, there are many references to edge and many pre-conceptions about what that might mean. The term ‘edge’ is typically used for devices that exist on the edge of a network and can cover a plethora of use cases, ranging from the router in your house, a smart video camera surveying a parking lot, to a control... » read more

Blog Review: July 17
By Jesse Allen - 17 Jul, 2024 - Comments: 0

Cadence's Xin Mu explains the PCIe ECN Unordered IO (UIO) feature in the PCIe 6.1 specification, which defines a new wire semantic and related capabilities to enable multiple-path fabric support and helps avoid unnecessary traffic for better bandwidth and latency. Synopsys' Dana Neustadter, Gary Ruggles, and Richard Solomon highlight the latest updates in the CXL 3.1 standard, including new ... » read more

Speed AND Accuracy: First-Of-Its-Kind Broad-Spectrum CFD Solver Built Natively on GPUs
By Ansys - 17 Jul, 2024 - Comments: 0

Since the advent of computational methods to solve physics problems, especially in the realm of fluid dynamics, scientists and engineers have had to balance the need for accurate simulations with faster times to solution — with available computing resources affecting this balance. Now, we introduce to you a new broad-spectrum native GPU solver created by developers at Ansys. Find more i... » read more

Managing kW Power Budgets
By Ed Sperling - 17 Jul, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss increasing power demands and how to address it with Hans Yeager, senior principal engineer, architecture, at Tenstorrent; Joe Davis, senior director for Calibre interfaces and EM/IR product management at Siemens EDA; Mo Faisal, CEO of Movellus; Trey Roessig, CTO and senior vice president of engineering at Empower Semiconductor.... » read more

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