A Low-Power BLS12-381 Pairing Cryptoprocessor for Internet-of-Things Security Applications
By Technical Paper Link - 21 Feb, 2022 - Comments: 0

Abstract: "We present the first BLS12-381 elliptic-curve pairing cryptoprocessor for Internet-of-Things (IoT) security applications. Efficient finite-field arithmetic and algorithm-architecture co-optimizations together enable two orders of magnitude energy savings. We implement several countermeasures against timing and power side-channel attacks. Our cryptoprocessor is programmable to provid... » read more

The Wiretap Channel for Capacitive PUF-Based Security Enclosures
By Technical Paper Link - 19 Feb, 2022 - Comments: 0

Abstract: "In order to protect devices from physical manipulations, protective security enclosures were developed. However, these battery-backed solutions come with a reduced lifetime, and have to be actively and continuously monitored. In order to overcome these drawbacks, batteryless capacitive enclosures based on Physical Unclonable Functions (PUFs) have been developed that generate a key-e... » read more

Microsphere-assisted, nanospot, non-destructive metrology for semiconductor devices
By Technical Paper Link - 19 Feb, 2022 - Comments: 0

Abstract "As smaller structures are being increasingly adopted in the semiconductor industry, the performance of memory and logic devices is being continuously improved with innovative 3D integration schemes as well as shrinking and stacking strategies. Owing to the increasing complexity of the design architectures, optical metrology techniques including spectroscopic ellipsometry (SE) and ref... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Feb, 2022 - Comments: 0

Chipmakers Intel has announced a definitive agreement to acquire Tower, a specialty foundry vendor, for approximately $5.4 billion. With the acquisition of Tower, Intel expands its efforts in the foundry business, and put its rivals on notice. With Tower, Intel gains access to mature processes as well as specialty technologies, such as analog, CMOS image sensor, MEMS, power management and RF. ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 18 Feb, 2022 - Comments: 0

AMD completed its acquisition of Xilinx. The all-stock deal ended up being valued at approximately $50 billion due to a rise in AMD's share price (the deal was valued at $35 billion when announced). The Xilinx business will become the newly formed Adaptive and Embedded Computing Group (AECG), led by former Xilinx CEO Victor Peng, and will continue its FPGA, adaptive SoC, and software roadmaps a... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 18 Feb, 2022 - Comments: 0

Automotive Renesas and AVL Software and Functions are collaborating to support developers of automotive ISO 26262-compliant electronic control units (ECUs). Renesas sells automotive R-Car SoCs, RH850 automotive control MCUs, PMICs, and software for levels ASIL B to ASIL D of ISO26262, but even with automotive ISO26262 parts, ECU system development process is never plug and play. Functional saf... » read more

Excess noise in high-current diamond diodes
By Technical Paper Link - 17 Feb, 2022 - Comments: 0

Abstract "We report the results of an investigation of low-frequency excess noise in high-current diamond diodes. It was found that the electronic excess noise of the diamond diodes is dominated by the 1/f and generation-recombination noise, which reveals itself as Lorentzian spectral features (f is the frequency). The generation-recombination bulges are characteristic of diamond diodes with l... » read more

A high speed processor for elliptic curve cryptography over NIST prime field
By Technical Paper Link - 17 Feb, 2022 - Comments: 0

Abstract "Elliptic curve cryptography (ECC), as one of the public key cryptography systems, has been widely applied to many security applications. It is challenging to implement a scalar multiplication (SM) operation which has the highest computational complexity in ECC. In this study, we propose a hardware processor which achieves high speed and high security for ECC. We first present a three... » read more

Technology Advances, Shortages Seen For Wire Bonders
By Mark LaPedus - 17 Feb, 2022 - Comments: 2

A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside advanced packaging’s rise. Wirebonding is an older technology that typically flies under the radar. Still, packaging houses have multitudes of these key tools that help assemble many — but no... » read more

Thermal Management Implications For Heterogeneous Integrated Packaging
By Cameron Nelson - 17 Feb, 2022 - Comments: 1

As the semiconductor industry reaches lower process nodes, silicon designers struggle to have Moore's Law produce the results achieved in earlier generations. Increasing the die size in a monolithic system on chip (SoC) designs is no longer economically viable. The breakdown of monolithic SoCs into specialized chips, referred to as chiplets, presents significant benefits in terms of cost, yield... » read more

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