Is Programmable Overhead Worth The Cost?
By Brian Bailey - 13 Jan, 2022 - Comments: 0

Programmability has fueled the growth of most semiconductor products, but how much does it actually cost? And is that cost worth it? The answer is more complicated than a simple efficiency formula. It can vary by application, by maturity of technology in a particular market, and in the context of much larger systems. What's considered important for one design may be very different for anothe... » read more

SuperGrid Institute Responds to Energy and Climate Demands
By Ronak Shah - 13 Jan, 2022 - Comments: 0

Researchers and developers at SuperGrid Institute use Ansys electronics software solutions to perform studies on power converters, critical links in the chain between electric generators and consumers, for their clients. Fig. 1: Medium-voltage DC grid power supply topology. As an independent research and innovation institute based in France, SuperGrid Institute is dedicated to developin... » read more

CES 2022: In Person But Not Many People
By Paul McLellan - 13 Jan, 2022 - Comments: 0

CES was and is officially hybrid, with some events on-site in Las Vegas and some online. But many of the large exhibitors pulled out of attending in person (including Cadence, although we might be a big exhibitor at DAC but at CES we are tiny). A lot of the press seems to have stayed away in-person too. To be honest, a lot of the press has been gradually staying away for years since so much is ... » read more

The Risk Of Losing Track Of Your IP
By Ed Sperling - 12 Jan, 2022 - Comments: 0

What happens when you misuse IP, intentionally or otherwise? Pedro Pires, applications engineer at Cliosoft, talks about the challenges of keeping track of IP across multiple chip design projects, which can grow to include dozens of third-party IP blocks, last for long periods of years, and span multiple continents. » read more

Accelerating Software Development With Fast Virtual Prototypes
By Synopsys - 12 Jan, 2022 - Comments: 0

Most of today's largest semiconductor devices are highly complex system on chip (SoC) designs, which means that they include one or more embedded processors. This indicates that software provides some of the key functionality of the chip. The system cannot be fully verified or validated without both hardware and software. However, software development generally takes more time and resources to ... » read more

Components And Tools for Functional Safety Applications
By Arm - 12 Jan, 2022 - Comments: 0

Functional safety is important across a variety of markets, including the automotive, industrial, medical, and railway sectors, and often prevalent in consumer electronics. However, the complexity of the embedded software required for functional safety is growing and security issues are rising due to connectivity requirements. This can result the failure of a safety-critical system and lead to ... » read more

High-Tech: Innovation At The Speed of Light
By Ansys - 12 Jan, 2022 - Comments: 0

As connectivity, digitalization, and autonomy proliferate, the boundaries between industries are blurring at an unprecedented pace. Promising to unleash $3TN in global technology market spending, the new competitive battleground is to be found where the system electronics and semiconductor worlds collide: The 3D Integrated Circuit System-on-a-Chip. Winning demands a new design paradigm that ... » read more

AI Goes Ultra Low Power — Part 1
By Fraunhofer IIS/EAS - 12 Jan, 2022 - Comments: 0

Based on the concept of the new Federal Agency for Jump Innovations (PSRIN-D), the BMBF initiated three pilot innovation competitions. One of them presented the participants with the task of developing the most energy-efficient AI system possible as a hardware implementation on an ASIC or FPGA. With this, a stack of hundreds of two-minute long ECG signals should be analyzed with a minimum of en... » read more

Setting Ground Rules For 3D-IC Designs
By Ed Sperling - 12 Jan, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

HyperRAM As A Low Pin-Count Expansion Memory For Embedded Systems
By Infineon - 12 Jan, 2022 - Comments: 0

Rapid advances in microelectronics are driving mega trends across industries, creating a need for new technologies and optimized devices with better performance. With large volumes of data being made available due to the increasing content of electronics in automotive, industrial, smart home and IoT devices, there is a requirement to seamlessly process and render information. Application platfo... » read more

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