A Memory Device With MoS2 Channel For High-Density 3D NAND Flash-Based In-Memory Computing
By Technical Paper Link - 26 Jun, 2024 - Comments: 0

A technical paper titled “Low-Power Charge Trap Flash Memory with MoS2 Channel for High-Density In-Memory Computing" was published by researchers at Kyungpook National University, Sungkyunkwan University, Dankook University, and Kwangwoon University. Abstract: "With the rise of on-device artificial intelligence (AI) technology, the demand for in-memory computing has surged for data-intensiv... » read more

Thermoelectric Active Cooling Hot Spots in Chips
By Technical Paper Link - 26 Jun, 2024 - Comments: 0

A technical paper titled “Thermoelectric active cooling for transient hot spots in microprocessors” was published by researchers at the University of Pittsburgh and Carnegie Mellon University. Abstract: "Modern microprocessor performance is limited by local hot spots induced at high frequency by busy integrated circuit elements such as the clock generator. Locally embedded thermoelectric ... » read more

New Way To Transmit Light Signals Through A Chip (NIST)
By Technical Paper Link - 26 Jun, 2024 - Comments: 0

A technical paper titled “Bound-state-in-continuum guided modes in a multilayer electro-optically active photonic integrated circuit platform” was published by researchers at the National Institute of Standards and Technology (NIST), University of Maryland, and Theiss Research. Abstract: "In many physical systems, the interaction with an open environment leads to energy dissipation and re... » read more

An LLM Approach For Large-Scale SoC Security Verification And Policy Generation (U. of Florida)
By Technical Paper Link - 26 Jun, 2024 - Comments: 0

A technical paper titled “SoCureLLM: An LLM-driven Approach for Large-Scale System-on-Chip Security Verification and Policy Generation” was published by researchers at the University of Florida. Abstract: "Contemporary methods for hardware security verification struggle with adaptability, scalability, and availability due to the increasing complexity of the modern system-on-chips (SoCs). ... » read more

Blog Review: June 26
By Jesse Allen - 26 Jun, 2024 - Comments: 0

Cadence's Neelabh Singh examines the Gen4 link recovery mechanism in USB4 Version 2.0, an autonomous process that is initiated by a router when it encounters uncorrectable error events, and identified verification challenges. Synopsys' Gary Ruggles and Priyank Shukla highlight improvements to PCIe 7.0 that will enable secure data transfers and boost bandwidth for the next generation of AI an... » read more

Moving Software-Defined Vehicles Forward
By Ann Mutschler - 26 Jun, 2024 - Comments: 0

Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

Advances in 3D-IC At DAC 2024
By Marc Swinnen - 26 Jun, 2024 - Comments: 0

At the 2024 Design Automation Conference and Exhibit, Ansys, in collaboration with NVIDIA, has been showcasing its latest advances in 3D-IC multiphysics analysis, visualization, and signoff. Ansys solutions are on display for thermal integrity, power integrity, signal integrity, and mechanical integrity for multi-die (3D-IC) electronic assemblies. The DAC Exhibitor Forum sessions, sponso... » read more

Research Bits: June 25
By Liz Allan - 25 Jun, 2024 - Comments: 0

Quantum on silicon Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) developed a platform to probe and control qubits in silicon for quantum networks, after an earlier discovery that defects in silicon could be used to send and store quantum information over widely used telecommunications wavelengths. The device uses an electric diode to manipulate... » read more

Chip Industry Technical Paper Roundup: June 25
By Linda Christensen - 25 Jun, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=236 /] More ReadingTechnical Paper Library home » read more

LPDDR Memory Is Key For On-Device AI Performance
By Nidish Kamath - 24 Jun, 2024 - Comments: 1

Low-Power Double Data Rate (LPDDR) emerged as a specialized high performance, low power memory for mobile phones. Since its first release in 2006, each new generation of LPDDR has delivered the bandwidth and capacity needed for major shifts in the mobile user experience. Once again, LPDDR is at the forefront of another key shift as the next wave of generative AI applications will be built into ... » read more

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