HBM3: Big Impact On Chip Design
By Ann Mutschler - 14 Oct, 2021 - Comments: 0

An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth memory. HBM3 will bring a 2X bump in bandwidth and capacity per stack, as well as some other benefits. What was once considered a "slow and wide" memory technology to reduce signal traffic dela... » read more

Challenges In RF Design
By Roland Jancke - 14 Oct, 2021 - Comments: 0

Designing highly integrated components for radio frequency applications poses special challenges for system engineers, designers and the commissioning engineers. The boundary between chip, package and board is increasingly vanishing on modern components. It is growing more common for parts of the functionality to be moved to the package or even the board. In some cases, the requirements have be... » read more

Architecting Interposers
By Brian Bailey - 14 Oct, 2021 - Comments: 0

An interposer performs a similar function as a printed circuit board (PCB), but when the interposer is moved inside a package the impact is significant. Neither legacy PCB nor IC design tools can fully perform the necessary design and analysis tasks. But perhaps even more important, adding an interposer to a design may require organizational changes. Today, leading-edge companies have shown ... » read more

How To Identify Common Electronic Failures
By Tyler Ferris - 14 Oct, 2021 - Comments: 0

Failure analysis is the process of identifying, and typically attempting to mitigate, the root cause of a failure. In the electronics industry, failure analysis involves isolating the failure to a location on a printed circuit board assembly (PCBA) before collecting more detailed data to investigate which component or board location is functioning improperly. A member of the Ansys Reliabil... » read more

Will Co-Packaged Optics Replace Pluggables?
By Bryon Moyer - 14 Oct, 2021 - Comments: 0

As optical connections work their way deeper into the data center, a debate is underway. Is it better to use pluggable optical modules or to embed lasers deep into advanced packages? There are issues of convenience, power, and reliability driving the discussion, and an eventual winner isn’t clear yet. “The industry is definitely embracing co-packaged optics,” said James Pond, principal... » read more

Choosing A Gate Driver For Silicon Carbide MOSFETs
By Olaf Bendix - 14 Oct, 2021 - Comments: 0

If you are going to use a silicon carbide (SiC) MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) in your next development, you will ask yourself: how do I develop the best gate driver for it? The answer to this question is: identify a suitable gate driver IC based on the peak current and power dissipation requirements of your application and a fitting gate resistor for your SiC... » read more

Latency Considerations Of IDE Deployment On CXL Interconnects
By Paul Karazuba - 14 Oct, 2021 - Comments: 0

Certain applications and hardware types – emerging memory, artificial intelligence/machine learning (AI/ML), and cloud servers, to name a few – can realize significant performance advantages when a low latency interface is employed. However, traditional interconnects like PCI Express (PCIe) often do not offer low enough latencies required to optimize these applications. In response, the Com... » read more

Multi-DRAM Memory Subsystems In SoCs
By Shyam Sharma - 14 Oct, 2021 - Comments: 0

Even with DRAM capacity going up with each generation of DRAM, the demand for memory densities by a variety of applications is growing at an even faster rate. To support these high memory densities and bus width requirements (that are typically more than what a single DRAM can support), almost all the new generation of memory subsystems and SoCs have multiple DRAM dies combined to effectively c... » read more

Bringing Scalable Power Integrity Analysis To Analog IC Designs
By Joe Davis - 14 Oct, 2021 - Comments: 0

Power integrity is a broad term in integrated circuit (IC) design and verification. However, when IC engineers are working through design signoff, power integrity analysis focuses on three specific aspects of a design: Power: Verify the chip design as implemented provides the total predicted power under different operating modes. Performance: Find and eliminate performance issues affect... » read more

Bringing Intelligent Headlamps To Light via Simulation
By Ansys - 13 Oct, 2021 - Comments: 0

Once seen as a basic, utilitarian product feature, today automotive headlamps are becoming much more innovative — and a critical source of competitive differentiation. Intelligent headlamps, which autonomously produce adaptive light beams, are capturing the imagination of the world’s automakers and consumers alike. But how can automotive engineering teams verify the performance of their com... » read more

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