AI Infrastructure: Optimized For Model Training
By Keysight - 28 May, 2025 - Comments: 0

This white paper discusses the critical infrastructure needed for efficient AI model training, emphasizing the role of network capabilities in handling vast data flows and minimizing delays. It outlines challenges in model training and innovative solutions that can enhance performance. AI Revolution: The increasing complexity of AI applications, such as autonomous vehicles and personalized m... » read more

Mastering AI Chip Complexity: Your Guide to First-Pass Silicon Success
By Synopsys - 28 May, 2025 - Comments: 0

This eBook provides a resource for innovators in the fast-changing realm of AI chip development. It delves into the opportunities and challenges of designing cutting-edge AI chips and chiplets, focusing on the transition from traditional monolithic architectures to multi-die and chiplet-based solutions. The content covers essential topics such as architectural exploration, silicon design, a... » read more

Blog Review: May 28
By Jesse Allen - 28 May, 2025 - Comments: 0

Siemens’ Patrick Hope considers how to fully perform post-route signal integrity verification on PCB designs while maintaining the project’s timeline by implementing a progressive verification methodology that enables signal integrity experts to focus on issues that demand their expertise rather than simple errors. Cadence’s Vanessa Do checks out how CXL addresses the constant demand f... » read more

Modernizing The Hardware / Software Interface – Life Beyond Spreadsheets
By Arteris - 28 May, 2025 - Comments: 0

The hardware/software interface (HSI) is the core of advanced semiconductor design, allowing seamless interaction between software and components like accelerators and peripherals. It underpins critical functions such as documentation, firmware, and hardware verification. Inefficient or outdated HSI management reduces collaboration, increases design errors, and threatens the performance and qua... » read more

Chip Industry Technical Paper Roundup: May 28
By Linda Christensen - 28 May, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=434 /] Find more semiconductor research papers here. » read more

Agentic AI, Multi-Block Multi-User SoC Design Platform
By Cadence - 28 May, 2025 - Comments: 0

The semiconductor industry is at an inflection point within its history. The latest technological advancements in AI, quantum computing, 5G, virtual and augmented reality, IoT, autonomous driving, and biotechnology have revolutionized the semiconductor industry. The growing demands of AI workloads and sophisticated model training are spurring highly specialized semiconductor chips with intricat... » read more

Inside Chips Podcast: May 27
By Gregory Haley - 27 May, 2025 - Comments: 0

Jo De Boeck, chief strategy officer and EVP at imec, talks with Semiconductor Engineering Technology Editor Gregory Haley about system technology co-optimization and the intersection of technology and AI. https://www.youtube.com/watch?v=XUgQPBIaDHQ » read more

Research Bits: May 27
By Jesse Allen - 27 May, 2025 - Comments: 0

Tracking ferroelectric domain walls Researchers from Oak Ridge National Laboratory and National Cheng Kung University developed a technique called scanning oscillator piezoresponse force microscopy to observe how domain walls move in ferroelectric materials under rapidly fluctuating electric fields. “Domain walls can have completely different properties from the neighboring domains they s... » read more

Chip Industry Week in Review
By The SE Staff - 23 May, 2025 - Comments: 0

Podcast: imec's roadmap and a one-on-one interview with the European research house's chief strategy officer. China's Xiaomi debuted an in-house-designed 10-core mobile SoC built on a 3nm process. The company did not identify the foundry. It also announced plans to invest 50 billion yuan (~$7B) over the next decade to develop high-end smartphone chips, as part of a 200 billion yuan (~$28B) c... » read more

Doping Mechanism Of Pure Nitric Oxide In Tungsten Diselenide Transistors (Purdue, MIT, NYCU)
By Technical Paper Link - 22 May, 2025 - Comments: 0

A technical paper titled "Uncovering the doping mechanism of nitric oxide in high-performance P-type WSe2 transistors" was published by researchers at Purdue University, MIT and National Yang Ming Chiao Tung University (with support from Intel Corporation). "Atomically thin two-dimensional (2D) semiconductors are promising candidates for beyond-silicon electronic devices. However, an excessi... » read more

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