Thermal Analysis Of 3D Stacking And BEOL Technologies
By Mohamed Naeim - 10 Apr, 2025 - Comments: 0

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization (STCO) promises to mitigate technology scaling bottlenecks with system architecture tuning based on emerging technology offerings, including 3D technology. AI-driven inference accelerators continu... » read more

Electronics Reliability In Space: Simulating Rad Hard Designs
By Aliyah Mallak - 10 Apr, 2025 - Comments: 0

Space is a harsh environment. There’s no breathable air, radiation levels are 15 times higher than on Earth, and the approximate temperature is 2.7 Kelvin (minus 270.45 degrees Celsius or minus 454.81 degrees Fahrenheit). Thankfully, Earth’s atmosphere does a great job protecting us from space’s intense climate. But because there is no atmosphere in space, there’s nothing to protect sat... » read more

3D-IC Ecosystem Starts To Take Form
By Brian Bailey - 10 Apr, 2025 - Comments: 0

The adoption of chiplets is inevitable, but exactly when a mass migration toward this design approach will begin is yet to be determined. Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based design remains beyond the economic reach of many companies today, that is starting to change. Early signs of an emerging ecosystem ... » read more

Pre-Silicon Hardware Trojans: Design, Benchmarking, Detection And Prevention (Sandia Labs)
By Technical Paper Link - 09 Apr, 2025 - Comments: 0

A new technical paper titled "A Survey on the Design, Detection, and Prevention of Pre-Silicon Hardware Trojans" was published by researchers at Sandia National Laboratories. "In this survey, we first highlight efforts in Trojan design and benchmarking, followed by a cataloging of seminal and recent works in Trojan detection and prevention and their accompanied metrics. Given the volume of l... » read more

Arm AI Readiness Index
By Arm - 09 Apr, 2025 - Comments: 0

The Arm AI Readiness Index report is a comprehensive analysis of global AI readiness and implementation for enterprises worldwide. Drawing on survey data from business leaders across eight countries, the report offers a range of insights exploring the global opportunities and challenges around AI, including: Business adoption Technology requirement The policy and regulatory landscape... » read more

Discovering Digital Twins: A Complete Guide
By Ansys - 09 Apr, 2025 - Comments: 0

As artificial intelligence (AI) and machine learning (ML) continue to revolutionize industries, their integration with simulation is amplifying the capabilities of digital twins. AI/ML, simulation, and reduced-order modeling (ROM) technologies combine to create hybrid digital twins—virtual replicas that blend data-driven insights with the accuracy of physics-based models. This powerful approa... » read more

Is Liquid Cooling Right for Your Data Center: eBook
By Cadence - 09 Apr, 2025 - Comments: 0

As data centers face rising chip densities and energy costs, liquid cooling is emerging as a powerful solution. But is it the right fit for your facility? This eBook covers the essentials to help you decide. Who Should Read This eBook: -Senior management of data center operations -Data center designers and consultants -Engineers in IT and facilities management Key Takeaways: -Lear... » read more

An Inside Look At UPF 4.0
By Barry Pangrle - 09 Apr, 2025 - Comments: 0

Energy and power efficiency are increasingly important in today’s products, and the additional complexity in new architectures to incorporate competitive power management schemes has magnified the need for newer and better methodologies for the verification, implementation, and reuse of power intent specifications. This is the focus of the new IEEE 1801-2024 Unified Power Format (UPF) 4.0 ... » read more

Transforming The Semiconductor Industry: Future Roadmap For Generative AI On The Edge
By Expedera - 09 Apr, 2025 - Comments: 0

In the third of a three-part series, Expedera, in conjunction with the Global Semiconductor Alliance’s Emerging Technologies (EmTech) group explores “Transforming the Semiconductor Industry: Future Roadmap for Generative AI on the Edge”. This white paper explores key applications for Generative AI and the features they enable, as well as an examination of how model growth and differing mo... » read more

GenAI for Analog IC Design (McMaster University)
By Technical Paper Link - 08 Apr, 2025 - Comments: 0

A new technical paper titled "Generative AI for Analog Integrated Circuit Design: Methodologies and Applications" was published by researchers at McMaster University. Abstract "Electronic Design Automation (EDA) in analog Integrated Circuits (ICs) has been the focus of extensive research; however, unlike its digital counterpart, it has not achieved widespread adoption. In this systematic re... » read more

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