The Quest For Curvilinear Photomasks
By Mark LaPedus - 15 Apr, 2021 - Comments: 1

The semiconductor industry is making noticeable progress on the development of advanced curvilinear photomasks, a technology that has broad implications for chip designs at the most advanced nodes and the ability to manufacture those chips faster and cheaper. The question now is when will this technology move beyond its niche-oriented status and ramp up into high-volume manufacturing. For ye... » read more

Latest IC Forecast: Big Demand, Shortages
By Mark LaPedus - 15 Apr, 2021 - Comments: 1

Over the last year, the semiconductor industry has seen its share of highs, lows and uncertainties. In early 2020, the business looked bright, but the IC market dropped amid the Covid-19 pandemic outbreak. Throughout 2020 different countries implemented a number of measures to mitigate the outbreak, such as stay-at-home orders and business closures. Economic turmoil and job losses soon follo... » read more

Will An Adhesion Promoter Prevent Delamination?
By Sophie Olson - 15 Apr, 2021 - Comments: 0

Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands on (and for) power packages have been growing. Packages for automotive applications must pass extensive testing for safety, therefore, packaging reliability is essential. As more semiconductor pack... » read more

Making Chip Packaging More Reliable
By Mark LaPedus - 15 Apr, 2021 - Comments: 0

Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

How Do Multi-Beam Mask Writers Enable Curvilinear Shapes On Photomasks?
By Jan Willis - 15 Apr, 2021 - Comments: 0

Multi-beam mask writing was identified as one of the ways to eliminate hurdles to manufacturing curvilinear mask shapes in the last installment of this blog. Our blog series continues with an educational video explanation of why and how multi-beam writers reduce write time for curvilinear mask shapes that took place during an eBeam Initiative panel discussion with industry experts during the 20... » read more

Going Vertical With GaN Devices
By Katherine Derbyshire - 15 Apr, 2021 - Comments: 1

Gallium nitride has long been on the horizon for a variety of uses in semiconductors, but implementing this on a commercial scale has been relatively slow due to a variety of technical hurdles. That may be about to change. The wide bandgap of GaN makes it particularly attractive material for power conversion applications. Still, actually realizing its benefits in commercial devices has been ... » read more

Global Fab Equipment Spending Poised To Log Three Straight Years Of Record Highs
By Christian Dieseldorff - 15 Apr, 2021 - Comments: 0

Fueled by surging pandemic-inspired demand for electronics devices, the global semiconductor industry is on track to register a rare three consecutive years of record highs in fab equipment spending with a 16% increase in 2020 followed by forecast gains of 15.5% this year and 12% in 2022, SEMI highlighted in its quarterly World Fab Forecast report. Fabs worldwide will add about $10 billion ... » read more

Advanced Packaging For Improved Network Communications
By Amkor - 14 Apr, 2021 - Comments: 0

The global demand for data increases day-by-day. At the same time, the data transmission rate will increase to exceed 1 Terabits per second (Tbps) near the middle of this decade. To address this situation and provide a third alternative, engineers are increasingly looking into the chiplet approach with multiple smaller dies integrated in a single package. Only the logic portion that needs to... » read more

Applications, Challenges For Using AI In Fabs
By Mark LaPedus - 14 Apr, 2021 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss chip scaling, transistors, new architectures, and packaging with Jerry Chen, head of global business development for manufacturing & industrials at Nvidia; David Fried, vice president of computational products at Lam Research; Mark Shirey, vice president of marketing and applications at KLA; and Aki Fujimura, CEO of D2S. Wh... » read more

Blog Review: April 14
By Jesse Allen - 14 Apr, 2021 - Comments: 0

Siemens EDA's Jake Wiltgen provides an overview of setting up an executing a fault injection campaign to prove that the IC or IP will safely operate under a faulted state caused by a random hardware failure, required to meet higher ASIL targets for ISO 26262 functional safety certification. Synopsys' Taylor Armerding considers the state of medical device security and the growing attack surfa... » read more

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