Week In Review: Design, Low Power
By Jesse Allen - 09 Apr, 2021 - Comments: 0

Tools & IP Cadence debuted the Palladium Z2 Enterprise Emulation and Protium X2 Enterprise Prototyping systems. The Palladium Z2 is based on a new custom emulation processor, while the Protium X2 is based on Xilinx UltraScale+ VU19P FPGAs. Designed to work together with a common front-end flow, they provide 2X capacity and 1.5X performance improvements over the previous generations, and ne... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 09 Apr, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back LG Electronics says it is closing its mobile business unit to focus on growth areas such as electric vehicle components, connected devices, smart homes, robotics, artificial intelligence and business-to-business solutions, as well as platforms and services. The company will continue to update some premium phones after it leaves th... » read more

Verification Effectiveness In The Face Of FPGA Complexity: The 2020 Wilson Research Group Functional Verification Study
By Harry Foster - 08 Apr, 2021 - Comments: 0

Making informed decisions backed by good data is the key to success in highly competitive, robust markets such as FPGA design and verification. Helping our community in that endeavor is the motivation behind the worldwide Wilson Research Group Functional Verification Study. We also use that information to make sure our research and development efforts continue to deliver the solutions our cu... » read more

Interconnects In A Domain-Specific World
By Brian Bailey - 08 Apr, 2021 - Comments: 0

Moving data around is probably the least interesting aspect of system design, but it is one of three legs that defines the key performance indicators (KPI) for a system. Computation, memory, and interconnect all need to be balanced. Otherwise, resources are wasted and performance is lost. The problem is that the interconnect is rarely seen as a contributor to system functionality. It is seen... » read more

3D Stacking For Performance And Efficiency
By Brian Cline - 08 Apr, 2021 - Comments: 0

Moore’s Law scaling is slowing down and limited improvements in performance, power, area, and cost are available from one process node to the next. As a result, advanced packaging and 3D stacking technologies are taking a front seat as the key drivers for next-generation high-performance energy-efficient designs. These types of system-in-package (SiP) technologies require designers to reima... » read more

Energy Harvesting Shows New Signs of Life
By Bryon Moyer - 08 Apr, 2021 - Comments: 1

Energy harvesting is seeing renewed activity in select markets, years after some high-profile attempts to build this into consumer electronics stalled out. Costs, manufacturing challenges, and market resistance kept this technology from moving forward, more than a decade after it was being touted as the best way forward for consumer electronics and devices that were hard to access. While sol... » read more

Meeting Fundamental Interface Requirements For Camera And Display With Integrated MIPI IP
By Licinio Sousa - 08 Apr, 2021 - Comments: 0

Cameras and displays are used in cars, industrial and medical devices, smartphones and other mobile devices, and machine vision applications. Over the years, the required data for high resolution videos and images have increased, forcing camera and display SoCs to process more complex visual data. The MIPI Alliance offers a portfolio of camera and display interfaces that deliver differentiation... » read more

More Data Drives Focus On IC Energy Efficiency
By Ann Mutschler - 08 Apr, 2021 - Comments: 0

Computing workloads are becoming increasingly interdependent, raising the complexity level for chip architects as they work out exactly where that computing should be done and how to optimize it for shrinking energy margins. At a fundamental level, there is now more data to compute and more urgency in getting results. This situation has forced a rethinking of how much data should be moved, w... » read more

PCB Design Rules For Electromagnetic Compatibility
By Nikhil Grover - 08 Apr, 2021 - Comments: 0

When it comes to electromagnetic interference (EMI) and printed circuit boards (PCBs), rules are not meant to be broken. Following some simple guidelines for electromagnetic compatibility when designing PCBs will save time and costs. Simulation software can help. All high-speed signals on a PCB should be referenced to a solid plane. A current flowing in any trace on a PCB must complete the e... » read more

Improving Industrial Processes
By Jens Döge - 08 Apr, 2021 - Comments: 0

Industrial image processing is one of the most important drivers of manufacturing automation today. The requirements on the cameras differ considerably depending on the application. Different measurement methods (2D, 2.5D, 3D), spatial and temporal resolution and scan rates can be employed. The resolution and dynamic range of the sensor are critical for optical inspection on manufacturing lines... » read more

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