Security In FPGAs And SoCs
By Ed Sperling - 23 Feb, 2021 - Comments: 0

Chip security is becoming a bigger problem across different markets, with different emerging standards and more sophisticated attacks. Jason Moore, senior director of engineering at Xilinx, talks with Semiconductor Engineering about current and future threats and what can be done about them. » read more

Manufacturing Bits: Feb. 23
By Mark LaPedus - 23 Feb, 2021 - Comments: 0

Space crystals Northrop Grumman recently launch its Cygnus spacecraft into space, sending thousands of pounds of critical supplies and experiments to the International Space Station (ISS). The launch, which took place from NASA’s Wallops Flight Facility in Virginia, will deliver a diversity of experiments to the ISS National Laboratory. In one experiment, Redwire’s sixth in-space man... » read more

Power/Performance Bits: Feb. 23
By Jesse Allen - 23 Feb, 2021 - Comments: 0

Photonic AI accelerator There are now many processors and accelerators focused on speeding up neural network performance, but researchers at the University of Münster, University of Oxford, Swiss Federal Institute of Technology Lausanne (EPFL), IBM Research Europe, and University of Exeter say AI processing could happen even faster with the use of photonic tensor processors that can handle mu... » read more

Brazil Paves New Semiconductor Path
By Mark LaPedus - 22 Feb, 2021 - Comments: 3

After struggling to get its semiconductor industry off the ground for the last several years, Brazil finally may have found its place in the market with the development of IC design services, memory modules and packaging. Brazil exists well under the radar when it comes to semiconductors. But with little or no fanfare, the nation over the years has been trying to build fabs, assemble chips a... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Feb, 2021 - Comments: 0

Chipmakers and OEMs A severe winter storm has hit many parts of the United States, including Texas. In Austin, utility providers are prioritizing service to residential areas. As a result, electricity and natural gas providers have temporarily suspended service to Austin’s semiconductor manufacturers, including Samsung and NXP. "Due to the recent blackouts in Texas, Samsung Austin Semicon... » read more

Week In Review: Design, Low Power
By Jesse Allen - 19 Feb, 2021 - Comments: 0

Analog Devices acquired the wireless assets of Comcores. Analog Devices plans to continue to evolve the wireless technology and participate in the O-RAN forum. Teams based in Denmark and Poland, including Comcores founder and former CEO, Thomas Noergaard, will join ADI. Comcores will retain its other lines of intellectual property and digital systems business, Chip-to-Chip and Ethernet Systems ... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 19 Feb, 2021 - Comments: 0

Aerospace The NASA's Mars Perseverance Rover, which landed safely on Mars this week, has some new autonomous systems. The landing craft flew autonomously to find a good landing spot. When on the ground, the rover can drive in an autonomous traverse mode. Also autonomous is the small helicopter, the Ingenuity Mars Helicopter, being tested on Mars. The helicopter can fly up to 90 seconds autonom... » read more

More Silicon Wafer Consolidation
By Mark LaPedus - 18 Feb, 2021 - Comments: 0

The silicon wafer business typically flies under the radar, but it’s a fundamental part of the semiconductor business. Every chipmaker needs to buy silicon wafers in one size or another. In the supply chain, silicon wafer vendors produce and sell bare or raw silicon wafers to chipmakers, who in turn process them into chips. So it’s important to keep an eye on the market. Today, the s... » read more

Shortages, Challenges Engulf Packaging Supply Chain
By Mark LaPedus - 18 Feb, 2021 - Comments: 0

A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in packaging surfaced in late 2020 and have since spread to other sectors. There are now a variety of choke points in the supply chain. Wirebond and flip-chip capacity will remain tight throughout 2021... » read more

Increasing The Conductive Density Of Packaging
By Shaun Bowers - 18 Feb, 2021 - Comments: 0

Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such as silicon carbide (SiC) and gallium nitride (GaN), have a higher figure of merit (FOM) compared to silicon MOSFETs and have extended the efficiency, output power and/or switching frequency range and operating temperature range for power electronics. With lower lo... » read more

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