Technical Papers: Organized, Timely, And Relevant

By Ed Sperling - 09 Mar, 2022 - Comments: 1

Engineers and scientists from every discipline linked to semiconductors have been struggling for years to find good research papers about trends and topics they care about, and the situation is only getting worse as the technology becomes more complex and the supply chain becomes more diverse and distributed. There are a slew of new issues in manufacturing, packaging, and design, and there a... » read more

Parasitic Characterization Comes To Power Design Simulation

By Don Dingee - 09 Mar, 2022 - Comments: 0

Two power design challenges are taking teams into unfamiliar territory. Wide bandgap (WBG) semiconductors target greater efficiency and density. Stricter EMI compliance regulations now come standard in mission-critical industries. Power design practices are still catching up. Simulation often takes a back seat to respinning hardware prototypes until success. What’s missing that could make sim... » read more

Who Will Own Debug?

By Hagai Arbel - 09 Mar, 2022 - Comments: 0

Recently, I had an interesting conversation with a verification leader of one of the world’s leading semiconductors companies. He has some 150 verification engineers in his organization and the group has been exploring EDA solutions for many years. While we’ve exchanged many ideas about EDA and innovation, one sentence that he said stays in my head: Whoever will own debug, will own th... » read more

Blog Review: March 9

By Jesse Allen - 09 Mar, 2022 - Comments: 0

Arm's Ajay Joshi investigates how to select the right benchmark for CPUs used in the Home device market, such as digital television and set-top box/over-the-top devices. Ansys' Jon Kordell checks out how reliability physics simulations and physical component characterization can support component swapping in high-reliability applications when the original part is unavailable due to supply ch... » read more

Advancing Electric Vehicle Battery Characterization By Integrating Drive Cycle On Cooling Impacts

By Ansys - 09 Mar, 2022 - Comments: 0

Battery powered electric vehicles (EVs) and hybrid electric vehicles (HEVs) have been gaining market share as the public’s environmental concerns drive the demand for better fuel efficiency. Apart from the need to improve the mileage one can drive before recharging, battery reliability is another major concern. Effective cooling in intense charge/discharge conditions is crucial to minimizi... » read more

Navigating The Intersection Of Safety And Security

By Siemens EDA - 09 Mar, 2022 - Comments: 0

Vehicle systems and the semiconductors used within them are some of the most complex electronics seen today. In the past, electronics going into vehicle systems implemented flat architectures with isolated functions controlling various components of the power train and vehicle dynamics. However, to support the realization of Level 4 and Level 5 (L4/L5) autonomous driving, a massive restructure ... » read more

A Framework For Ultra Low-Power Hardware Accelerators Using NNs For Embedded Time Series Classification

By Fraunhofer IIS/EAS - 09 Mar, 2022 - Comments: 0

In embedded applications that use neural networks (NNs) for classification tasks, it is important to not only minimize the power consumption of the NN calculation, but of the whole system. Optimization approaches for individual parts exist, such as quantization of the NN or analog calculation of arithmetic operations. However, there is no holistic approach for a complete embedded system design ... » read more

Pinpointing the Dominant Component of Contact Resistance to Atomically Thin Semiconductors

By Technical Paper Link - 08 Mar, 2022 - Comments: 0

Abstract "Achieving good electrical contacts is one of the major challenges in realizing devices based on atomically thin two-dimensional (2D) semiconductors. Several studies have examined this hurdle, but a universal understanding of the contact resistance and an underlying approach to its reduction are currently lacking. In this work we expose the shortcomings of the classical contact resist... » read more

SparseP: Towards Efficient Sparse Matrix Vector Multiplication on Real Processing-In-Memory Systems

By Technical Paper Link - 08 Mar, 2022 - Comments: 0

Abstract "Several manufacturers have already started to commercialize near-bank Processing-In-Memory (PIM) architectures. Near-bank PIM architectures place simple cores close to DRAM banks and can yield significant performance and energy improvements in parallel applications by alleviating data access costs. Real PIM systems can provide high levels of parallelism, large aggregate memory bandwi... » read more

Zero-Bias Power-Detector Circuits based on MoS₂ Field-Effect Transistors on Wafer-Scale Flexible Substrates

By Technical Paper Link - 08 Mar, 2022 - Comments: 0

Abstract: "We demonstrate the design, fabrication, and characterization of wafer-scale, zero-bias power detectors based on two-dimensional MoS2 field effect transistors (FETs). The MoS2 FETs are fabricated using a wafer-scale process on 8 μm thick polyimide film, which in principle serves as flexible substrate. The performances of two CVD-MoS2 sheets, grown with different processes and showi... » read more

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