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Blog Review: March 9

Benchmarking for digital TVs; reliability for replacement parts; configurability and safety.

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Arm’s Ajay Joshi investigates how to select the right benchmark for CPUs used in the Home device market, such as digital television and set-top box/over-the-top devices.

Ansys’ Jon Kordell checks out how reliability physics simulations and physical component characterization can support component swapping in high-reliability applications when the original part is unavailable due to supply chain shortages.

Siemens’ Jake Wiltgen and Chuck Battikha consider how adding configurability to an IP or IC can result in significant challenges and overhead when delivering safety analysis and an ISO 26262 compliant product.

Cadence’s Paul McLellan looks at how governments around the world are trying to encourage stronger semiconductor manufacturing industries at home.

Synopsys’ Varun Agrawal checks out Source-Based Tone Mapping, a new feature in HDMI 2.1a that allows for better display of different types of content such as SDR, HDR, dynamic HDR, and graphics when they are displayed together on the same screen.

SEMI’s Michelle Williams-Vaden argues for why it’s important for microelectronics companies to focus on retaining skilled and knowledgeable employees, including by being aware of employee well-being.

In a video, VLSI Research’s Dan Hutcheson chats with Micron’s Scott DeBoer about what it takes to innovate in the memory market today.

And don’t miss the blogs featured in the recent Automotive, Security, & Pervasive Computing and Test, Measurement & Analytics newsletters:

Arteris IP’s Guillaume Boillet digs into planning and compromises between software and hardware.

Rambus’ Bart Stevens shows how resisting side-channel attacks starts with a proper security threat assessment.

Tortuga Logic’s Anders Nordstrom recommends translating hardware CWEs into security rules for regression runs.

Cadence’s Paul McLellan presents some big ideas that could shape the Internet’s next decade.

Infineon’s Jaeeul Yeon lays out how to ensure a package’s isolation characteristics are sufficient for environmentally harsh conditions.

AMD’s Ed Rebello looks at optimizing servers for the requirements of the current task.

Synopsys’ Omar Cruz focuses on preventing malicious attacks while mitigating systematic and random faults.

Onto’s Wesley Chou points to the need to identify open defects earlier in the manufacturing process to limit the impact on yield.

Synopsys’ Rahul Singhal and Giri Podichetty illustrate test requirements of AI chips that integrate multiple dies and memories on the same package.

Siemens EDA’s Aileen Ryan shows how extensive monitoring of silicon devices in the field helps improve reliability, safety, and security.

proteanTecs’ Uzi Baruch makes the case for using data to manage data center infrastructure.



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