More Than Meets The Eye: Trends In Lithography
By Travis Brist - 23 Jan, 2025 - Comments: 0

Lithography, once the exclusive domain of artists and printmakers, also lies at the heart of integrated circuit (IC) production. The process of shining light on a substrate through a photomask to control exposure has been around since the 1960s and has been the key part of improving IC fabrication process resolution. At the time, the light sources used were in the human-visible spectrum, which ... » read more

Less Waste, Faster Results: Why Virtual Twins Are Critical To Future Semiconductor R&D
By Wojtek Osowiecki - 23 Jan, 2025 - Comments: 0

By Wojciech (Wojtek) Osowiecki, Martyn Coogans, Saravanapriyan Sriraman, Rakesh Ranjan, Yu (Joe) Lu, and David M. Fried The semiconductor industry has long depended on physical experimentation to achieve the precision needed for advanced chip manufacturing. However, this traditional method comes with significant environmental costs—high energy consumption, material waste, and greenhouse ga... » read more

Integrated Design Ecosystem For Chiplets And Heterogeneous Integration In Advanced Packaging Technology
By Lihong Cao - 23 Jan, 2025 - Comments: 0

As the demand for high-performance computing (HPC) continues to grow, chiplets and heterogeneous integration have emerged as key solutions due to their significant advantages in improving yield, reusing IP, enhancing performance, and optimizing costs. The integration of chiplets, particularly for AI applications, necessitates a greater number of connections than traditional monolithic system-on... » read more

Electrifying Everything: Power Moves Toward ICs
By Gregory Haley - 23 Jan, 2025 - Comments: 0

As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. The next wave of innovation is to bring power control closer to the action — directly on the chip or into a heterogeneous package. This change is driven by a relentless pursuit of efficiency, scala... » read more

Upcoming Challenges And Changes In Semiconductor Materials
By Laura Peters And Ed Sperling - 23 Jan, 2025 - Comments: 0

Semiconductor Engineering sat down with Dan Brewer and Srikanth Kommu, co-CEOs at Brewer Science, to talk about current and future changes in materials used in semiconductor manufacturing and adjacent markets. What follows are excerpts of that conversation. SE: What was behind the decision to have co-CEOs instead of just one? Brewer: We see a lot of value to having multiple perspectives b... » read more

Advancing Medical Devices Through Heterogeneous Integration
By David Fromm - 23 Jan, 2025 - Comments: 0

As medical treatments continue to evolve, innovation in medical devices plays a vital role, enabling increasingly complex, precise, and safer interventions. For example: Endoscopic devices provide high-resolution in vivo imaging, Wearable sensors offer real-time monitoring of vital signs, Implantable devices engage with the human body at the cellular level. These devices’ ongo... » read more

MEMS And Imaging Drive The Sensor Revolution
By Ana Bernardo - 23 Jan, 2025 - Comments: 0

By Ana Bernardo and Sitong He As the world becomes increasingly interconnected, MEMS and imaging sensor technologies are driving transformative changes across industries, shaping the future of connectivity, intelligence, and sustainability. Powered by advances in miniaturization, AI integration, and sustainable design, MEMS and imaging technologies are enabling groundbreaking applications—... » read more

Improving GaN Device Architectures
By Katherine Derbyshire - 23 Jan, 2025 - Comments: 0

As the universe of applications for power devices grows, designers are finding that no single semiconductor can cover the full range of voltage and current requirements. Instead, combination circuits use different materials for different parts of the overall operating range. GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and... » read more

New Class Of Memory: Managed-Retention Memory or MRM (Microsoft Research)
By Technical Paper Link - 22 Jan, 2025 - Comments: 0

A new technical paper titled "Managed-Retention Memory: A New Class of Memory for the AI Era" was published by researchers at Microsoft. Abstract "AI clusters today are one of the major uses of High Bandwidth Memory (HBM). However, HBM is suboptimal for AI workloads for several reasons. Analysis shows HBM is overprovisioned on write performance, but underprovisioned on density and read band... » read more

Livelocks And Deadlocks In NoCs
By Ed Sperling - 22 Jan, 2025 - Comments: 0

Devices that are stuck in a specific state, or which appear to be making progress even though they are not, are common problems in complex systems. Processing elements need to fetch data they don't have from routers may be frozen out by other processors, a problem that is exacerbated by common bus protocols. Ashish Darbari, CEO of Axiomise, talks about how to identify potential bottlenecks, why... » read more

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